ATS-20C-159-C2-R0
AI

The **ATS-20C-159-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** manufactured by Advanced Thermal Solutions (ATS).
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Heat Sink Type** | Straight Fin |
| **Attachment Method** | Push-Pin (Brass, 7-10mm reach) |
| **Spring Type** | Compression Spring (Steel) |
| **Thermal Resistance** | 2.09°C/W (at 200 LFM) |
| **Dimensions** | 45mm x 45mm x 20mm |
| **Thermal Interface** | T766 (Pre-applied Phase Change Material) |
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### 2. Electronic Component Breakdown
#### A. The Heat Sink Body
The "Straight Fin" design is optimized for **forced air cooling**. In electronic assemblies, this part is mounted directly onto integrated circuits (ICs) such as CPUs, FPGAs, or GPUs. The aluminum construction ensures rapid heat transfer away from the die.
#### B. The Push-Pin Attachment Mechanism
Unlike adhesive-based heat sinks, the ATS-20C-159-C2-R0 uses a mechanical attachment system:
* **Purpose:** Provides consistent pressure (clamping force) across the electronic chip.
* **Benefit:** Improves thermal contact and ensures the heat sink remains secure during high-vibration environments (standard in telecommunications or industrial servers).
#### C. Thermal Interface Material (TIM)
This specific model comes with **T766** pre-applied. In electronics, the TIM is critical because it fills microscopic air gaps between the chip and the heat sink, significantly lowering thermal resistance.
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### 3. Part Number Decoding (ATS-20C-159-C2-R0)
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer: Advanced Thermal Solutions |
| **20** | Product Series (Standard Heat Sink) |
| **C** | Fin Configuration (Straight Fin) |
| **159** | Specific sizing/template code |
| **C2** | Thermal Interface Material (T766) |
| **R0** | RoHS Compliant / Revision Status |
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### 4. Typical Applications
* **Networking Hardware:** Routers and high-speed switches.
* **Embedded Systems:** Industrial PCs and automation controllers.
* **Power Electronics:** Voltage regulators and high-density power modules.
- ⤷
What are the airflow requirements to achieve the rated 2.09\u00b0C/W thermal resistance?
- ⤷ How do I calculate the PCB hole diameter required for the push-pin mounting?
- ⤷ What is the difference between the C2 and C1 thermal interface materials?