Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-20C-159-C2-R0

  • AI
    The **ATS-20C-159-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** manufactured by Advanced Thermal Solutions (ATS). --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Heat Sink Type** | Straight Fin | | **Attachment Method** | Push-Pin (Brass, 7-10mm reach) | | **Spring Type** | Compression Spring (Steel) | | **Thermal Resistance** | 2.09°C/W (at 200 LFM) | | **Dimensions** | 45mm x 45mm x 20mm | | **Thermal Interface** | T766 (Pre-applied Phase Change Material) | --- ### 2. Electronic Component Breakdown #### A. The Heat Sink Body The "Straight Fin" design is optimized for **forced air cooling**. In electronic assemblies, this part is mounted directly onto integrated circuits (ICs) such as CPUs, FPGAs, or GPUs. The aluminum construction ensures rapid heat transfer away from the die. #### B. The Push-Pin Attachment Mechanism Unlike adhesive-based heat sinks, the ATS-20C-159-C2-R0 uses a mechanical attachment system: * **Purpose:** Provides consistent pressure (clamping force) across the electronic chip. * **Benefit:** Improves thermal contact and ensures the heat sink remains secure during high-vibration environments (standard in telecommunications or industrial servers). #### C. Thermal Interface Material (TIM) This specific model comes with **T766** pre-applied. In electronics, the TIM is critical because it fills microscopic air gaps between the chip and the heat sink, significantly lowering thermal resistance. --- ### 3. Part Number Decoding (ATS-20C-159-C2-R0) | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **20** | Product Series (Standard Heat Sink) | | **C** | Fin Configuration (Straight Fin) | | **159** | Specific sizing/template code | | **C2** | Thermal Interface Material (T766) | | **R0** | RoHS Compliant / Revision Status | --- ### 4. Typical Applications * **Networking Hardware:** Routers and high-speed switches. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Voltage regulators and high-density power modules.
    ✨ Follow-up Questions
    • ⤷ What are the airflow requirements to achieve the rated 2.09\u00b0C/W thermal resistance?
    • ⤷ How do I calculate the PCB hole diameter required for the push-pin mounting?
    • ⤷ What is the difference between the C2 and C1 thermal interface materials?