The **ATS-20D-03-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their high-performance **push-pin heat sink** series, designed for cooling integrated circuits (ICs) and surface-mount devices (SMDs). --- ## Technical Specifications The following table outlines the physical and thermal properties of the device: | Property | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 15.97°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 9.70mm | | **Fin Style** | Straight Fin | | **RoHS Status** | Compliant | --- ## Electronic and Mechanical Parts Breakdown The assembly of the ATS-20D-03-C2-R0 consists of three main electronic cooling components: ### 1. The Heat Sink Body * **Design:** A square 40mm x 40mm aluminum plate with vertical straight fins. * **Function:** It increases the surface area available for heat dissipation. The "Blue Anodized" coating is not just for aesthetics; it provides corrosion resistance and slightly improves radiative heat transfer. ### 2. Push-Pin Fasteners * **Hardware:** It utilizes two spring-loaded push pins. * **Purpose:** These pins provide constant pressure (compression) on the electronic component (CPU/GPU/FPGA), ensuring the thermal interface material is compressed correctly for maximum heat transfer. * **Hole Pattern:** Designed for pre-drilled holes on a Printed Circuit Board (PCB). ### 3. Thermal Interface Material (TIM) * **Pre-Applied Material:** This specific model usually comes with **ATS-PPS-03** (or similar) phase-change material or thermal tape pre-applied to the base. * **Role:** It fills microscopic air gaps between the semiconductor package and the aluminum heat sink, significantly reducing thermal resistance. --- ## Part Number Breakdown (Nomenclature) Understanding the suffix codes helps identify the specific electronic environment this part is suited for: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **20:** Series number. * **D:** Fin pattern/Density. * **03:** Specific height/configuration code. * **C2:** Thermal performance/Attachment kit code (typically refers to the spring strength and pin material). * **R0:** RoHS compliance indicator. --- ## Application Use Cases This component is commonly found in: 1. **Telecommunications:** Cooling network switches and routers. 2. **Computing:** Chipset cooling on motherboards. 3. **Industrial:** Cooling high-speed motor controllers or power modules.