The **ATS-20D-05-C2-R0** is a specific part number for a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their "maxiFLOW™" product line, designed primarily for cooling high-power electronic components like CPUs, GPUs, and ASICs. --- ## 1. Technical Specifications The following table highlights the core physical and thermal characteristics of this specific component: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Base Series** | maxiFLOW™ | | **Dimensions (L x W)** | 37.00 mm x 37.00 mm | | **Height** | 9.50 mm | | **Thermal Resistance** | 9.23° C/W (at 200 LFM) | | **Material** | Aluminum (Blue Anodized Finish) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Airflow Direction** | Directional / Flared Fins | --- ## 2. Key Electronic & Design Features ### A. maxiFLOW™ Fin Geometry The "D" in the part number refers to the fin geometry. Unlike standard extruded heat sinks, these feature a **flared fin** design. * **Electronic Impact:** This maximizes the surface area and increases air turbulence, which significantly improves thermal performance in constrained spaces where airflow might be limited. ### B. pushPIN™ Attachment System The part utilizes the **pushPIN™** mounting mechanism. * **Mechanical Stability:** It uses a brass or plastic pin with a stainless steel spring. This ensures a consistent "Normal Force" is applied to the electronic component (like a processor), ensuring optimal contact with the Thermal Interface Material (TIM). * **Vibration Resistance:** This makes it suitable for electronics in industrial or automotive environments where vibration is a factor. ### C. Material and Finish * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Coating:** Provides two benefits: 1. **Corrosion Resistance:** Protects the aluminum from oxidation. 2. **Radiation Cooling:** Anodized surfaces have higher emissivity than bare metal, improving heat dissipation via radiation. --- ## 3. Applications in Electronics This specific heat sink is typically used for: 1. **Embedded Systems:** Cooling SoCs (System on Chips) on PCB boards. 2. **Network Switches:** Providing thermal relief for high-speed packet processors. 3. **Power Supplies:** Cooling MOSFETs or power regulators that generate significant localized heat. --- ## 4. Part Number Breakdown (Nomenclature) | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **20** | Component Family / Series | | **D** | Flared Fin Design | | **05** | Dimension / Fin Configuration Identifier | | **C2** | Blue Anodized Finish | | **R0** | RoHS Compliant / Revision code |