The **ATS-20D-07-C3-R0** is a specific part number for a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" series, designed for cooling electronic components such as CPUs, GPUs, or high-power semiconductors. --- ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Dimensions (L x W x H)** | 45mm x 45mm x 12.7mm | | **Attachment Method** | pushPIN™ (Brass springs/plastic pins) | | **Fin Style** | Straight Fin | | **Pattern** | Fine Pitch | | **Finish** | Blue Anodized | | **Thermal Interface (TIM)** | T412 (Phase-change material) | --- ### Component Breakdown #### 1. Heat Sink Body The body is made of **Aluminum 6063**, which is the industry standard for heat sinks due to its high thermal conductivity and light weight. The "Straight Fin" design allows for efficient airflow, provided there is a cooling fan or consistent system air pressure. #### 2. Attachment Mechanism: pushPIN™ Unlike adhesive-based heat sinks, this model uses a spring-loaded pin system. * **Benefits:** It provides consistent pressure on the electronic chip, which optimizes heat transfer. * **Reliability:** It is more secure than thermal tape and allows for easier removal or re-application during maintenance. #### 3. Thermal Interface Material (TIM) The **T412** coating is pre-applied to the base of the heat sink. This is a high-performance thermal pad that fills the microscopic air gaps between the component (the chip) and the heat sink, ensuring maximum thermal dissipation. #### 4. Finish: Blue Anodized The blue anodization is not just for aesthetics; it provides surface protection against corrosion and slightly improves radiant heat emission. --- ### Thermal Performance Metrics Thermal resistance is measured in Celsius per Watt (°C/W). Lower values indicate better cooling performance. * **Unducted Flow:** 17.09 °C/W (@ 100 LFM) * **Ducted Flow:** 2.73 °C/W (@ 100 LFM) --- ### Application Usage This part is commonly found in: * **Networking Equipment:** Routers and switches. * **Industrial PCs:** Compact systems requiring high-reliability cooling. * **Power Supplies:** Cooling voltage regulators or MOSFETs.