ATS-20D-100-C2-R0
AI

The **ATS-20D-100-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to provide high thermal performance in environments with constrained airflow.
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### 1. Technical Specifications
The following table summarizes the primary electrical and physical characteristics of this part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | maxiFLOW™ |
| **Material** | Aluminum (Anodized Blue) |
| **Attachment Method** | pushPIN™ |
| **Thermal Resistance (Flowing)** | 1.50°C/W @ 200 LFM |
| **Thermal Resistance (Static)** | 4.80°C/W (Unducted) |
| **Dimensions (L x W)** | 45.00mm x 45.00mm |
| **Height** | 25.00mm |
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### 2. Key Features and Design
This component is more than a simple block of metal; it incorporates specific engineering features to cool sensitive integrated circuits (ICs):
* **maxiFLOW™ Fin Design:** The fins are spread out in a "flared" pattern. This increases the surface area and creates turbulence in the airflow, which helps strip heat away from the surface more efficiently than straight-fin designs.
* **pushPIN™ Attachment:** Instead of messy thermal glue or simple clips, this model uses a spring-loaded push-pin system. This ensures a consistent "force" or pressure against the chip, which is critical for maintaining an even layer of thermal interface material (TIM).
* **Pre-Applied TIM:** These units typically come with **SAINT-GOBAIN C700** or similar high-performance thermal interface material pre-applied to the base, reducing assembly time.
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### 3. Electronic Application
The ATS-20D-100-C2-R0 is commonly used for cooling the following types of electronic components:
1. **FPGAs (Field Programmable Gate Arrays):** High-density chips that generate significant heat during high-speed processing.
2. **ASICs:** Application-specific chips found in networking hardware and telecommunications.
3. **Processors:** High-end microcontrollers or embedded CPUs in industrial computing.
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### 4. Part Number Breakdown
The part number follows a specific nomenclature used by ATS:
* **ATS:** Manufacturer prefix.
* **20:** Series/Style designation.
* **D:** Specific fin geometry or attachment variant.
* **100:** Relative size/height code.
* **C2:** Blue Anodized finish.
* **R0:** Revision code.
- ⤷
What is the significance of the 1.50°C/W thermal resistance rating?
- ⤷ How does the pushPIN™ system compare to traditional adhesive mounting?
- ⤷ Are there specific airflow requirements for this heat sink to be effective?