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  • ATS-20D-100-C2-R0

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    The **ATS-20D-100-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to provide high thermal performance in environments with constrained airflow. --- ### 1. Technical Specifications The following table summarizes the primary electrical and physical characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance (Flowing)** | 1.50°C/W @ 200 LFM | | **Thermal Resistance (Static)** | 4.80°C/W (Unducted) | | **Dimensions (L x W)** | 45.00mm x 45.00mm | | **Height** | 25.00mm | --- ### 2. Key Features and Design This component is more than a simple block of metal; it incorporates specific engineering features to cool sensitive integrated circuits (ICs): * **maxiFLOW™ Fin Design:** The fins are spread out in a "flared" pattern. This increases the surface area and creates turbulence in the airflow, which helps strip heat away from the surface more efficiently than straight-fin designs. * **pushPIN™ Attachment:** Instead of messy thermal glue or simple clips, this model uses a spring-loaded push-pin system. This ensures a consistent "force" or pressure against the chip, which is critical for maintaining an even layer of thermal interface material (TIM). * **Pre-Applied TIM:** These units typically come with **SAINT-GOBAIN C700** or similar high-performance thermal interface material pre-applied to the base, reducing assembly time. --- ### 3. Electronic Application The ATS-20D-100-C2-R0 is commonly used for cooling the following types of electronic components: 1. **FPGAs (Field Programmable Gate Arrays):** High-density chips that generate significant heat during high-speed processing. 2. **ASICs:** Application-specific chips found in networking hardware and telecommunications. 3. **Processors:** High-end microcontrollers or embedded CPUs in industrial computing. --- ### 4. Part Number Breakdown The part number follows a specific nomenclature used by ATS: * **ATS:** Manufacturer prefix. * **20:** Series/Style designation. * **D:** Specific fin geometry or attachment variant. * **100:** Relative size/height code. * **C2:** Blue Anodized finish. * **R0:** Revision code.
    ✨ Follow-up Questions
    • ⤷ What is the significance of the 1.50°C/W thermal resistance rating?
    • ⤷ How does the pushPIN™ system compare to traditional adhesive mounting?
    • ⤷ Are there specific airflow requirements for this heat sink to be effective?