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  • ATS-20D-11-C2-R0

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    The **ATS-20D-11-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Heat Sink Type** | push-PIN™ | | **Attachment Method** | push-PIN™ (Spring-loaded) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 50mm x 50mm | | **Height** | 10.00 mm | | **Thermal Resistance** | 18.74°C/W (at 100 LFM) | --- ## 2. Key Electronic Features ### A. push-PIN™ Mounting System Unlike adhesive-based heat sinks, this model uses a mechanical push-PIN system. * **Uniform Pressure:** Ensures consistent contact between the electronic component and the heat sink. * **Reliability:** Resistant to vibrations, making it suitable for industrial or automotive electronics. * **Pre-drilled Holes:** Designed for specific PCB layouts with a 43mm hole-to-hole pitch. ### B. Thermal Interface Material (TIM) This specific part comes with **T766** pre-applied thermal interface material. * **Purpose:** Fills microscopic air gaps between the chip and the heat sink to maximize heat transfer. * **Benefit:** Reduces installation time and ensures optimal thermal conductivity out of the box. ### C. Fin Profile (Straight Fin) The "Straight Fin" design is optimized for **forced air cooling**. * In systems with fans, the air travels through the channels created by the fins, stripping heat away from the aluminum surface efficiently. --- ## 3. Application Use-Cases * **Power Modules:** MOSFETs or IGBTs in power supply units. * **Embedded Systems:** Cooling for ARM-based processors or FPGAs. * **Networking Gear:** Cooling chips in routers, switches, and high-speed hubs. --- ## 4. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS-20** | Series Identifier | | **D** | Fin Pattern (Straight Fin) | | **11** | Specific configuration/height code | | **C2** | Blue Anodized Finish | | **R0** | Revision/Packaging code |
    ✨ Follow-up Questions
    • ⤷ What is the maximum thermal resistance for this heat sink under passive cooling conditions?
    • ⤷ How does the push-PIN attachment compare to adhesive thermal tapes in terms of longevity?
    • ⤷ Can this heat sink be used with components smaller than 50mm x 50mm?