ATS-20D-11-C2-R0
AI

The **ATS-20D-11-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
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## 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Heat Sink Type** | push-PIN™ |
| **Attachment Method** | push-PIN™ (Spring-loaded) |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Dimensions** | 50mm x 50mm |
| **Height** | 10.00 mm |
| **Thermal Resistance** | 18.74°C/W (at 100 LFM) |
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## 2. Key Electronic Features
### A. push-PIN™ Mounting System
Unlike adhesive-based heat sinks, this model uses a mechanical push-PIN system.
* **Uniform Pressure:** Ensures consistent contact between the electronic component and the heat sink.
* **Reliability:** Resistant to vibrations, making it suitable for industrial or automotive electronics.
* **Pre-drilled Holes:** Designed for specific PCB layouts with a 43mm hole-to-hole pitch.
### B. Thermal Interface Material (TIM)
This specific part comes with **T766** pre-applied thermal interface material.
* **Purpose:** Fills microscopic air gaps between the chip and the heat sink to maximize heat transfer.
* **Benefit:** Reduces installation time and ensures optimal thermal conductivity out of the box.
### C. Fin Profile (Straight Fin)
The "Straight Fin" design is optimized for **forced air cooling**.
* In systems with fans, the air travels through the channels created by the fins, stripping heat away from the aluminum surface efficiently.
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## 3. Application Use-Cases
* **Power Modules:** MOSFETs or IGBTs in power supply units.
* **Embedded Systems:** Cooling for ARM-based processors or FPGAs.
* **Networking Gear:** Cooling chips in routers, switches, and high-speed hubs.
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## 4. Part Number Breakdown
| Segment | Meaning |
| :--- | :--- |
| **ATS-20** | Series Identifier |
| **D** | Fin Pattern (Straight Fin) |
| **11** | Specific configuration/height code |
| **C2** | Blue Anodized Finish |
| **R0** | Revision/Packaging code |
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What is the maximum thermal resistance for this heat sink under passive cooling conditions?
- ⤷ How does the push-PIN attachment compare to adhesive thermal tapes in terms of longevity?
- ⤷ Can this heat sink be used with components smaller than 50mm x 50mm?