The **ATS-20D-141-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Fin Type** | Straight Fin (High Density) | | **Dimensions** | 30.00mm x 30.00mm x 10.00mm | | **Thermal Resistance** | 15.76°C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Spring Type** | ATS-PP-04 | --- ## 2. Key Electronic & Physical Components ### A. The Heat Sink Body The body is constructed from **Aluminum 6063**, which is favored in electronics for its high thermal conductivity and lightweight properties. The "Straight Fin" design allows for maximum surface area, facilitating heat transfer into the surrounding air via convection. ### B. pushPIN™ Attachment System This specific model uses the ATS proprietary **pushPIN™** system. Instead of using messy thermal adhesives or simple clips, it uses: * **Compression Springs:** Provides precise pressure (Force) to ensure optimal contact with the electronic chip. * **Plastic/Brass Push Pins:** Designed to snap into pre-drilled holes on a Printed Circuit Board (PCB). ### C. Thermal Interface Material (TIM) The "C2" in the part number typically indicates that the heat sink comes pre-applied with **T766 thermal phase change material** or a high-performance thermal grease. This fills the microscopic air gaps between the chip and the heat sink to reduce thermal impedance. --- ## 3. Performance Analysis The efficiency of this part is measured by its thermal resistance across different airflow conditions (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 15.76 | | 300 | 1.5 | 9.18 | | 500 | 2.5 | 7.33 | | 700 | 3.5 | 6.42 | --- ## 4. Typical Applications * **Networking Equipment:** Routers, switches, and high-speed modems. * **Embedded Systems:** Industrial PCs and IoT gateways. * **Power Supplies:** Cooling voltage regulators or MOSFETs.