The **ATS-20D-142-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Anodized Blue) | | **Thermal Resistance** | 10.07°C/W @ 100 LFM (Linear Feet per Minute) | | **Base Dimensions** | 30mm x 30mm | | **Height** | 15mm | | **Fin Style** | Straight (Push-Pin) | | **Attachment Method** | Push-Pin (Plastic) with Compression Spring | --- ## 2. Key Components & Design Features ### A. Push-Pin Attachment Mechanism Unlike adhesive-based heat sinks, the "C2-R0" designation typically refers to the attachment style. - **Push-Pins:** Plastic pins that snap into pre-drilled holes on the PCB. - **Springs:** Brass or steel springs provide consistent downward pressure, ensuring maximum contact between the heat sink base and the electronic chip. ### B. Material and Coating - **Aluminum Alloy:** Chosen for its excellent thermal conductivity and lightweight properties. - **Blue Anodized Finish:** The blue coating is not just aesthetic; anodization increases the surface emissivity and protects the aluminum from corrosion and electrical conductivity. ### C. Fin Geometry - The **straight-fin** design is optimized for "forced air" cooling (systems with fans). - The spacing between fins is calculated to minimize pressure drop while maximizing the surface area available for heat exchange. --- ## 3. Performance Data (Airflow vs. Thermal Resistance) Thermal resistance indicates how many degrees Celsius the component temperature will rise per watt of power dissipated. Lower numbers are better. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 10.07 | | 300 (Moderate) | 5.40 | | 500 (High) | 4.30 | --- ## 4. Typical Applications This specific size and mounting style are commonly found in: 1. **Networking Equipment:** Routers, switches, and modems. 2. **Embedded Systems:** Single-board computers (SBCs) and industrial controllers. 3. **Power Electronics:** High-voltage regulators and MOSFET arrays.