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  • ATS-20D-147-C2-R0

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    ## Technical Overview: ATS-20D-147-C2-R0 The **ATS-20D-147-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed specifically for cooling electronic components such as processors, FPGAs, and ASICs. --- ### 1. General Specifications This part is a mechanical component used to dissipate heat from electronic integrated circuits. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 3.31°C/W (at 200 LFM) | --- ### 2. Physical Dimensions The dimensions are critical for PCB layout planning and ensuring no interference with surrounding components. | Dimension | Value | | :--- | :--- | | **Length/Width** | 30.00 mm x 30.00 mm | | **Height** | 10.00 mm | | **Pin Spread** | 35.00 mm | | **Weight** | ~40 grams | --- ### 3. Electronic Cooling Performance The "C2" in the part number indicates the specific thermal interface material (TIM) or performance tier. This heat sink is evaluated based on airflow (LFM - Linear Feet per Minute). * **Low Airflow (200 LFM):** 3.31 °C/W * **Medium Airflow (400 LFM):** 2.20 °C/W * **High Airflow (600 LFM):** 1.80 °C/W --- ### 4. Key Components of the Assembly 1. **Heat Sink Body:** Features a "spread fin" design that increases surface area and maximizes air turbulence for better cooling. 2. **pushPIN™ Attachment:** Uses a brass or plastic pin with a high-tension spring. This ensures consistent pressure between the heat sink and the chip. 3. **Thermal Interface Material (TIM):** Pre-applied **T766** phase-change material or similar, which fills microscopic air gaps between the component and the sink. --- ### 5. Part Number Decoder Understanding the nomenclature: | Code Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **20D** | Series/Product Family | | **147** | Specific Fin Geometry/Size | | **C2** | Thermal Performance/Material Grade | | **R0** | Revision or RoHS Compliance status |
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the pushPIN attachment system?
    • ⤷ Does this heat sink come with pre-applied thermal grease?
    • ⤷ Can this be used for a 35mm x 35mm BGA chip?