ATS-20D-147-C2-R0
AI

## Technical Overview: ATS-20D-147-C2-R0
The **ATS-20D-147-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed specifically for cooling electronic components such as processors, FPGAs, and ASICs.
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### 1. General Specifications
This part is a mechanical component used to dissipate heat from electronic integrated circuits.
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | maxiFLOW™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Thermal Resistance** | 3.31°C/W (at 200 LFM) |
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### 2. Physical Dimensions
The dimensions are critical for PCB layout planning and ensuring no interference with surrounding components.
| Dimension | Value |
| :--- | :--- |
| **Length/Width** | 30.00 mm x 30.00 mm |
| **Height** | 10.00 mm |
| **Pin Spread** | 35.00 mm |
| **Weight** | ~40 grams |
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### 3. Electronic Cooling Performance
The "C2" in the part number indicates the specific thermal interface material (TIM) or performance tier. This heat sink is evaluated based on airflow (LFM - Linear Feet per Minute).
* **Low Airflow (200 LFM):** 3.31 °C/W
* **Medium Airflow (400 LFM):** 2.20 °C/W
* **High Airflow (600 LFM):** 1.80 °C/W
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### 4. Key Components of the Assembly
1. **Heat Sink Body:** Features a "spread fin" design that increases surface area and maximizes air turbulence for better cooling.
2. **pushPIN™ Attachment:** Uses a brass or plastic pin with a high-tension spring. This ensures consistent pressure between the heat sink and the chip.
3. **Thermal Interface Material (TIM):** Pre-applied **T766** phase-change material or similar, which fills microscopic air gaps between the component and the sink.
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### 5. Part Number Decoder
Understanding the nomenclature:
| Code Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **20D** | Series/Product Family |
| **147** | Specific Fin Geometry/Size |
| **C2** | Thermal Performance/Material Grade |
| **R0** | Revision or RoHS Compliance status |
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What are the PCB hole requirements for the pushPIN attachment system?
- ⤷ Does this heat sink come with pre-applied thermal grease?
- ⤷ Can this be used for a 35mm x 35mm BGA chip?