The **ATS-20D-148-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (typically AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | ~2.36°C/W (at 200 LFM) | | **Dimensions** | 35.00mm x 35.00mm x 15.00mm | | **Spring Type** | Stainless Steel (R0 series) | --- ### 2. Key Electronic & Mechanical Components #### A. Fin Design (Heat Dissipation) This model utilizes a **High-Performance "Straight Fin"** pattern. This design maximizes surface area for air-to-metal contact. It is optimized for "forced air" environments where fans move air across the fins. #### B. The Push-Pin Mechanism Unlike adhesive-based heat sinks, the "pushPIN" system ensures: * **Constant Pressure:** A stainless steel spring maintains a specific "preload" force on the electronic chip, ensuring the thermal interface material (TIM) is compressed evenly. * **Secure Attachment:** Plastic push-pins lock into pre-drilled holes (typically 3.0mm) on the Printed Circuit Board (PCB). #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates that this unit typically comes with **ATS-PPS-02** or a similar high-performance thermal pad pre-applied to the base. This fills microscopic air gaps between the component and the heat sink to improve heat transfer. --- ### 3. Application Use Cases This specific heat sink size (35mm) is common in the following electronic assemblies: 1. **Network Switches/Routers:** For cooling ASICs or FPGA chips. 2. **Industrial PCs:** Used on power-dense modules where space is limited but cooling is critical. 3. **Power Supplies:** Cooling voltage regulators or DC-DC converters. --- ### 4. Dimension Summary ```markdown Height: 15.00 mm Length: 35.00 mm Width: 35.00 mm Pitch: 1.20 mm (approx. fin spacing) ```