The **ATS-20D-149-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW" series, specifically designed for cooling electronic components like CPUs, GPUs, or high-power semiconductors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 6.21°C/W (at 200 LFM) | | **Dimensions (L x W)** | 30.00 mm x 30.00 mm | | **Height (H)** | 20.00 mm | | **Fin Style** | maxiFLOW (Tapered Fin) | | **Compatibility** | R0 (RoHS Compliant) | --- ### 2. Key Electronic & Mechanical Features #### A. Tapered Fin Design (maxiFLOW™) The "maxiFLOW" geometry features a flared fin structure. This design increases the surface area while reducing pressure drop, making it highly efficient in forced-air environments (fans). It is designed to capture airflow from any direction. #### B. pushPIN™ Attachment Unlike simple adhesive tapes, the **pushPIN™** system uses a spring-loaded pin mechanism. This provides: * **Constant Pressure:** Ensures optimal contact between the heat sink and the electronic component. * **Reliability:** Resistant to vibrations and thermal cycling. * **Hardware:** Usually paired with a brass or plastic pin and a stainless steel spring. #### C. Thermal Interface Material (TIM) The "C2" in the part number typically denotes the pre-applied thermal interface. * **Type:** T766 (or similar high-performance phase-change material). * **Function:** Fills microscopic air gaps between the component die and the heat sink base to maximize heat transfer. --- ### 3. Application Use Cases This specific part is used in high-density electronic assemblies where space is limited but heat dissipation is critical: 1. **Telecommunications:** Cooling of high-speed ASICs in routers or switches. 2. **Embedded Systems:** Industrial PCs where fan noise must be minimized but thermal safety is required. 3. **Power Electronics:** Cooling of MOSFETs or voltage regulators in power supplies. --- ### 4. Part Number Breakdown The nomenclature follows a specific logic: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **20:** Series/Attachment type. * **D:** Performance/Material grade. * **149:** Unique geometric identifier. * **C2:** Thermal Interface Material (TIM) and Finish type. * **R0:** RoHS compliance status.