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  • ATS-20D-15-C2-R0

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    The **ATS-20D-15-C2-R0** is a high-performance electronic component specifically designed for thermal management. It is a **heat sink** manufactured by Advanced Thermal Solutions (ATS) as part of their "pushPIN™" series. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Fin Type** | Fine Pitch (Straight) | | **Thermal Resistance (Flowing)** | 1.58 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 2.64 °C/W | --- ### 2. Physical Dimensions Precision sizing is critical for ensuring the heat sink fits within the PCB constraints without interfering with neighboring components. * **Length:** 45.00 mm * **Width:** 45.00 mm * **Height:** 20.00 mm * **Pitch (Hole-to-Hole):** 38.00 mm --- ### 3. Electronic Application and Utility While the part itself is mechanical, its role in an electronic system is vital for circuit stability: * **Heat Dissipation:** It is designed to be mounted on top of high-heat-generating semiconductors such as CPUs, GPUs, FPGAs, or Power MOSFETs. * **Airflow Optimization:** The "Fine Pitch" design allows for maximum surface area, making it highly efficient in systems with forced-air cooling (fans). * **Secure Mounting:** The `C2-R0` suffix indicates it uses a specific spring-loaded push-pin mechanism. This provides consistent pressure on the thermal interface material (TIM), ensuring optimal heat transfer from the chip to the aluminum fins. ### 4. Part Number Breakdown The part number follows a specific nomenclature: * **ATS:** Manufacturer (Advanced Thermal Solutions) * **20:** Series designation * **D:** Fin pitch/style * **15:** Height code * **C2:** Thermal Interface Material / Color (Blue Anodized) * **R0:** Revision/Packaging code ---
    ✨ Follow-up Questions
    • ⤷ What type of thermal interface material (TIM) is pre-applied to this model?
    • ⤷ How does the push-pin mounting system compare to adhesive mounting?
    • ⤷ What are the recommended airflow conditions (LFM) for this specific heat sink?