ATS-20D-15-C2-R0
AI

The **ATS-20D-15-C2-R0** is a high-performance electronic component specifically designed for thermal management. It is a **heat sink** manufactured by Advanced Thermal Solutions (ATS) as part of their "pushPIN™" series.
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### 1. Technical Specifications
The following table summarizes the key physical and thermal characteristics of this part:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Fin Type** | Fine Pitch (Straight) |
| **Thermal Resistance (Flowing)** | 1.58 °C/W @ 100 LFM |
| **Thermal Resistance (Static)** | 2.64 °C/W |
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### 2. Physical Dimensions
Precision sizing is critical for ensuring the heat sink fits within the PCB constraints without interfering with neighboring components.
* **Length:** 45.00 mm
* **Width:** 45.00 mm
* **Height:** 20.00 mm
* **Pitch (Hole-to-Hole):** 38.00 mm
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### 3. Electronic Application and Utility
While the part itself is mechanical, its role in an electronic system is vital for circuit stability:
* **Heat Dissipation:** It is designed to be mounted on top of high-heat-generating semiconductors such as CPUs, GPUs, FPGAs, or Power MOSFETs.
* **Airflow Optimization:** The "Fine Pitch" design allows for maximum surface area, making it highly efficient in systems with forced-air cooling (fans).
* **Secure Mounting:** The `C2-R0` suffix indicates it uses a specific spring-loaded push-pin mechanism. This provides consistent pressure on the thermal interface material (TIM), ensuring optimal heat transfer from the chip to the aluminum fins.
### 4. Part Number Breakdown
The part number follows a specific nomenclature:
* **ATS:** Manufacturer (Advanced Thermal Solutions)
* **20:** Series designation
* **D:** Fin pitch/style
* **15:** Height code
* **C2:** Thermal Interface Material / Color (Blue Anodized)
* **R0:** Revision/Packaging code
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- ⤷
What type of thermal interface material (TIM) is pre-applied to this model?
- ⤷ How does the push-pin mounting system compare to adhesive mounting?
- ⤷ What are the recommended airflow conditions (LFM) for this specific heat sink?