The **ATS-20D-150-C2-R0** is a high-performance thermal management component, specifically a **push-pin heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-20D-150-C2-R0 | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic) with Spring | | **Dimension (L x W)** | 35.00mm x 35.00mm | | **Height** | 25.00mm | | **Fin Style** | Straight Fin (High density) | | **Thermal Resistance** | 4.82 °C/W (@ 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Component Analysis ### A. Mechanical Design * **Form Factor:** The 35mm square footprint is a standard size for mid-range integrated circuits (BGA/PGA packages). * **Push-Pin Mounting:** This part uses a mechanical push-pin system. This is superior to "clip-on" or "adhesive" methods because it provides constant, uniform pressure on the chip, improving thermal transfer and ensuring the heat sink stays attached during vibration or shipping. ### B. Material and Finish * **Aluminum 6063:** Provides a high strength-to-weight ratio and excellent thermal conductivity. * **Blue Anodized Coating:** This is not just for aesthetics; the anodized layer increases surface emissivity, which helps slightly with radiation cooling and protects the aluminum from oxidation and environmental corrosion. ### C. Thermal Performance The "C2" in the part number indicates a specific thermal configuration. The straight-fin design is optimized for **forced-air cooling** (airflow from a fan). At an airflow of 100 LFM (Linear Feet per Minute), it can dissipate enough heat to keep sensitive electronics within their Operating Temperature range. --- ## 3. Usage Example To integrate this into a PCB design, you would typically use the following footprints for the push-pin holes: ```markdown Hole Diameter: 3.0mm Hole Pitch (Spacing): ~41.0mm (standard for 35mm heatsinks) ``` ---