The **ATS-20D-151-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to ensure system stability. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Specification | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ Heat Sink | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Dimensions (L x W)** | 35.00mm x 35.00mm | | **Height (Fin Depth)** | 10.00mm | | **Material** | Aluminum (Lightweight and conductive) | | **Finish** | Blue Anodized (Corrosion resistance) | | **Thermal Resistance** | Approx. 3.90°C/W (at 200 LFM air flow) | --- ### 2. Key Electronic Features * **pushPIN™ Attachment:** This allows for a secure, tool-free mounting to the PCB. It uses a spring-loaded mechanism that provides precise pressure for optimal thermal contact. * **Cross-Cut Fin Design:** The "151" in the part number indicates a specific fin pattern. Cross-cut fins allow for multi-directional airflow, making it ideal for compact electronic enclosures where airflow direction might be inconsistent. * **High Performance Interface:** It is typically paired with a **Thermal Interface Material (TIM)** or "pre-applied" thermal tape to fill microscopic air gaps between the heat sink and the electronic chip. --- ### 3. Typical Applications This specific heat sink is used in hardware where space is limited but thermal loads are significant: 1. **Networking Hardware:** Routers, switches, and high-speed modems. 2. **Industrial Controls:** Power modules and motor drivers. 3. **Embedded Systems:** Single-board computers (SBCs) and FPGA modules. --- ### 4. Thermal Performance Data (Example) Thermal resistance varies based on air velocity (Measured in Linear Feet per Minute - LFM): | Air Flow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 6.50 | | 300 | 1.5 | 3.20 | | 500 | 2.5 | 2.50 |