The **ATS-20D-16-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. It belongs to the *maxiFLOW™* series produced by **Advanced Thermal Solutions (ATS)**. --- ### 1. Technical Specifications The part number encodes specific mechanical and thermal characteristics. Here is the breakdown: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 10.00mm | | **Thermal Resistance** | 1.80°C/W (@ 200 LFM) | | **Pressure Drop** | 0.12 inH2O (@ 200 LFM) | | **Mounting Hole Pattern** | 47.00mm x 47.00mm | --- ### 2. Key Design Features #### A. Fin Geometry (maxiFLOW™) Unlike standard extruded heatsinks, the maxiFLOW design features a **flared fin structure**. This increases the surface area and maximizes air velocity, which significantly improves thermal performance in constrained spaces where airflow might be limited. #### B. Attachment System (pushPIN™) The part uses a **pushPIN™** mounting system. This is a specialized mechanical attachment that provides several benefits: * **Constant Pressure:** A built-in spring ensures a consistent, high-pressure contact between the heatsink and the component, optimizing heat transfer. * **Easy Installation:** It uses pre-drilled holes in the PCB, allowing for quick assembly without adhesives. * **Reliability:** It is more secure than thermal tape in high-vibration or high-heat environments. #### C. Thermal Interface Material (TIM) The "C2" suffix typically indicates that the heatsink comes pre-applied with a **Thermal Interface Material** (usually a high-performance phase-change material or grease). This eliminates the air gaps between the chip and the heatsink base. --- ### 3. Application Use Cases The ATS-20D-16-C2-R0 is commonly used in high-power density environments such as: * **Network Switches/Routers:** Cooling high-speed ASICs. * **Embedded Computing:** For processors in industrial computers. * **Telecommunications:** Cooling FPGA and DSP chips. * **Power Supplies:** Managing heat from MOSFETs or IGBTs. --- ### 4. Part Number Breakdown ```text ATS - 20 - D - 16 - C2 - R0 | | | | | | | | | | | +-- Revision/Standard Pack | | | | +------- Thermal Interface (T766/Phase Change) | | | +------------ Height (10mm) | | +----------------- Fin Pitch/Style | +---------------------- Serial/Family Number +--------------------------- Advanced Thermal Solutions ```