The **ATS-20D-166-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS. Below are the primary technical characteristics: | Feature | Specification | | :--- | :--- | | **Product Type** | Heat Sink (Passive Cooling) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Mounting Type** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 12.30°C/W (Unducted Flow @ 100 LFM) | | **Flow Pattern** | Square Fin (High Efficiency) | | **Dimensions (L x W x H)** | 25mm x 25mm x 15mm | --- ### 2. Key Components & Design Features #### A. pushPIN™ Attachment System This part features the patented **pushPIN™ mounting system**. It consists of: * **Plastic/Brass Pins:** Inserted into pre-drilled holes in the PCB. * **Compression Springs:** Provide precise, consistent pressure (Force) across the interface for optimal heat transfer. * **Flexibility:** It allows for easy installation and removal without the need for messy adhesives or permanent bonding. #### B. Material and Coating * **Aluminum Body:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization protects the aluminum from corrosion and slightly improves heat radiation characteristics. #### C. Fin Geometry (Square/Cross-Cut) The fins are designed to maximize surface area within a small 25mm footprint. The "C3" designation typically refers to a specific fin density and arrangement optimized for low-to-medium airflow environments. --- ### 3. Thermal Performance Matrix Thermal resistance measures how effectively the heat sink moves heat away from the component. Performance improves as airflow (LFM - Linear Feet per Minute) increases: | Air Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 12.30 | | 300 | 1.5 | 5.91 | | 500 | 2.5 | 4.30 | | 700 | 3.5 | 3.59 | --- ### 4. Application Use-Cases * **Embedded Systems:** Cooling small-form-factor processors. * **Telecommunications:** Dissipating heat from high-speed data transceivers. * **Power Electronics:** Managing heat for voltage regulators and MOSFETs.