The **ATS-20D-192-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 35mm | | **Thermal Resistance (Flowing Air)** | ~0.70° C/W @ 200 LFM | | **Thermal Resistance (Static Air)** | ~2.30° C/W | --- ## 2. Component Breakdown ### A. The Heat Sink Body (pushPIN™) The "192" series features high-performance cross-cut fin geometry. This design increases surface area and allows for multi-directional airflow, making it more efficient in compact electronic enclosures where air direction might vary. ### B. Attachment Mechanism (R0) The **-R0** suffix indicates the attachment style and Thermal Interface Material (TIM): * **pushPIN™ System:** This part uses a brass or plastic pin with a stainless steel spring. This ensures consistent pressure (clamping force) between the heat sink and the electronic chip, which is critical for heat transfer. * **Pre-Applied TIM:** These units usually come with a high-performance thermal phase-change material or grease pre-applied to the base to simplify assembly. ### C. Material and Coating * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Finish:** While primarily aesthetic, the anodization layer provides corrosion resistance and slightly improves emissivity compared to bare aluminum. --- ## 3. Part Number Nomenclature Understanding the code helps in identifying the exact variant: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Brand) | | **20D** | Series/Product Family (pushPIN™ series) | | **192** | Specific Fin Pattern and Height | | **C2** | Material/Finish Code (Blue Anodized) | | **R0** | Revision/Packaging/TIM type | --- ## 4. Application Use Cases * **Embedded Systems:** Cooling high-wattage SoC (System on Chip). * **Telecommunications:** Cooling FPGA and ASIC chips in rack-mounted hardware. * **Industrial Power Supplies:** Dissipating heat from MOSFETs or IGBTs.