ATS-20D-196-C2-R0
AI

The **ATS-20D-196-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** designed by Advanced Thermal Solutions (ATS). It is engineered for cooling integrated circuits (ICs) like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of this specific model:
| Property | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Brass) |
| **Spring Type** | Compression Spring |
| **Dimensions (L x W x H)** | 45mm x 45mm x 15mm |
| **Thermal Resistance** | 18.11°C/W (Natural Convection) |
| **Flow Pattern** | Cross-Cut (Straight Fin) |
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### 2. Design and Construction
#### **Material & Finish**
The body is made of high-grade aluminum, which offers high thermal conductivity while remaining lightweight. The **Blue Anodized** coating is not just for aesthetics; it provides surface protection against corrosion and slightly increases emissivity for better radiant heat transfer.
#### **Fin Geometry (Cross-Cut)**
Unlike simple longitudinal fins, the "cross-cut" design allows for multi-directional airflow. This makes it highly efficient in "crowded" PCB environments where airflow might come from various angles rather than a single intake fan.
#### **Attachment System**
The "Push-Pin" mechanism (specifically the brass variant used here) ensures:
* **Constant Pressure:** The compression springs provide uniform pressure across the TIM (Thermal Interface Material), optimizing heat transfer from the chip to the sink.
* **Secure Mounting:** It prevents the heat sink from shifting during mechanical shock or vibration.
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### 3. Application Use Cases
This component is typically found in:
1. **Telecommunications:** Cooling network switches and routers.
2. **Industrial PC:** Cooling processors in fanless or low-airflow enclosures.
3. **Embedded Systems:** For high-performance modules that require a low-profile (15mm) cooling solution.
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### 4. Thermal Performance Comparison
The performance of the ATS-20D-196-C2-R0 scales based on the Air Velocity (LFM - Linear Feet per Minute):
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 200 (1.0 m/s) | 3.98 |
| 400 (2.0 m/s) | 2.56 |
| 600 (3.0 m/s) | 2.10 |
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- ⤷
What are the PCB hole requirements for mounting this push-pin heat sink?
- ⤷ Does this model come with pre-applied Thermal Interface Material (TIM)?
- ⤷ How does blue anodization compare to black anodization in terms of thermal performance?