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  • ATS-20D-196-C2-R0

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    The **ATS-20D-196-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** designed by Advanced Thermal Solutions (ATS). It is engineered for cooling integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Property | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Thermal Resistance** | 18.11°C/W (Natural Convection) | | **Flow Pattern** | Cross-Cut (Straight Fin) | --- ### 2. Design and Construction #### **Material & Finish** The body is made of high-grade aluminum, which offers high thermal conductivity while remaining lightweight. The **Blue Anodized** coating is not just for aesthetics; it provides surface protection against corrosion and slightly increases emissivity for better radiant heat transfer. #### **Fin Geometry (Cross-Cut)** Unlike simple longitudinal fins, the "cross-cut" design allows for multi-directional airflow. This makes it highly efficient in "crowded" PCB environments where airflow might come from various angles rather than a single intake fan. #### **Attachment System** The "Push-Pin" mechanism (specifically the brass variant used here) ensures: * **Constant Pressure:** The compression springs provide uniform pressure across the TIM (Thermal Interface Material), optimizing heat transfer from the chip to the sink. * **Secure Mounting:** It prevents the heat sink from shifting during mechanical shock or vibration. --- ### 3. Application Use Cases This component is typically found in: 1. **Telecommunications:** Cooling network switches and routers. 2. **Industrial PC:** Cooling processors in fanless or low-airflow enclosures. 3. **Embedded Systems:** For high-performance modules that require a low-profile (15mm) cooling solution. --- ### 4. Thermal Performance Comparison The performance of the ATS-20D-196-C2-R0 scales based on the Air Velocity (LFM - Linear Feet per Minute): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 3.98 | | 400 (2.0 m/s) | 2.56 | | 600 (3.0 m/s) | 2.10 | ---
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for mounting this push-pin heat sink?
    • ⤷ Does this model come with pre-applied Thermal Interface Material (TIM)?
    • ⤷ How does blue anodization compare to black anodization in terms of thermal performance?