The **ATS-20D-200-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs. --- ### 1. Component Specifications The following table breaks down the physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Brass) | | **Dimension (L x W x H)** | 45mm x 45mm x 25mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 1.31°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic & Mechanical Parts #### A. The Heat Sink Body The core component is made of **extruded aluminum**. Aluminum is chosen for its high thermal conductivity and lightweight properties. The "Straight Fin" design allows for maximum airflow in a specific direction, making it ideal for systems with directed cooling fans. #### B. Push-Pin Mounting Mechanism Unlike adhesive-based heat sinks, the `-R0` series uses a mechanical push-pin system: * **Pins:** Usually made of brass or plastic; these provide the tension required to hold the sink against the chip. * **Springs:** High-tension springs ensure consistent "clamping force," which improves the contact between the heat sink and the electronic component, reducing thermal resistance. #### C. Thermal Interface Material (TIM) The base of the ATS-20D-200-C2-R0 comes with **T766** pre-applied. In electronics, the TIM is critical because it fills microscopic air gaps between the heat source (the silicon chip) and the metal heat sink, significantly increasing heat transfer efficiency. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying the specific electronic application: | Segment | Meaning | | :--- | :--- | | **ATS-20** | Series designation (Push-pin heat sink) | | **D** | Material/Fin pattern code | | **200** | Dimension code (Relates to the 45mm width) | | **C2** | Color/Finish (Blue Anodized) | | **R0** | Revision or specific packaging code | --- ### 4. Integration in Circuit Design When integrating this part into a PCB layout, an engineer must account for: 1. **Hole Pattern:** The PCB must have pre-drilled holes to match the push-pin spacing. 2. **Keep-out Zone:** A clearance area around the component to prevent the metal fins or pins from shorting nearby surface-mount devices (SMDs). 3. **Airflow Direction:** Because this is a straight-fin model, it must be oriented parallel to the system's airflow for optimal cooling.