The **ATS-20D-207-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Specification | Details | | :--- | :--- | :--- | | **Series** | pushPIN™ | Uses a push-pin attachment mechanism | | **Base Material** | Aluminum | Lightweight with high thermal conductivity | | **Finish** | Blue Anodized | Increases surface area and prevents corrosion | | **Thermal Resistance** | 6.39°C/W (Unducted) | Measures efficiency at 100 LFM airflow | | **Attachment Type** | Push-Pin | Spring-loaded plastic or metal pins | | **Thermal Interface** | T766 | Pre-applied phase-change thermal material | --- ### 2. Physical Dimensions The dimensions are critical for ensuring the part fits within the PCB layout and clears neighboring components. | Dimension | Value (mm) | Description | | :--- | :--- | :--- | | **Length (A)** | 54.00 mm | Overall footprint length | | **Width (B)** | 54.00 mm | Overall footprint width | | **Height (C)** | 12.70 mm | Height from base to fin tip | | **Pitch (E)** | 47.00 mm | Distance between mounting holes | --- ### 3. Electronic Design Features #### A. Thermal Management Strategy The heat sink uses a **cross-cut fin design**. This allows for "multi-directional" airflow, meaning it can dissipate heat effectively regardless of which direction the cooling fan is blowing. #### B. The pushPIN™ Mechanism Instead of using messy adhesives or permanent solder, this part uses a spring-loaded push-pin system. * **Pressure:** The springs provide consistent pressure across the component surface, ensuring optimal thermal transfer. * **Reliability:** It prevents the heat sink from shifting during mechanical shock or vibration. #### C. Thermal Interface Material (TIM) The "C2" in the part number refers to the **T766 thermal grease/pad** pre-applied to the bottom. This fills microscopic air gaps between the electronic chip and the aluminum base, significantly reducing thermal resistance. --- ### 4. Typical Applications * **Telecommunications:** Network switches and routers. * **Industrial PC:** Embedded systems where vertical space (12.7mm) is limited. * **Power Supplies:** Cooling high-wattage transistors or MOSFETs.