The **ATS-20D-209-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "superGRIP" series, designed primarily for cooling high-power electronic components such as BGAs (Ball Grid Arrays), CPUs, and GPUs. --- ## 1. Technical Specifications Below are the primary technical parameters for this specific part number: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | superGRIP™ | | **Material** | Aluminum (AL 6063) | | **Finish** | Blue Anodized | | **Attachment Method** | superGRIP™ Clip (Plastic Frame + Spring Clip) | | **Dimensions (L x W x H)** | 70.00mm x 70.00mm x 10.00mm | | **Thermal Resistance** | Approx. 6.27°C/W (Natural Convection) | | **TIM (Thermal Interface Material)** | Pre-applied T766 (High performance) | --- ## 2. Key Electronic Features ### A. Low-Profile Fin Design The "209" in the part number indicates a specific fin pattern. With a height of only **10mm**, this heat sink is designed for space-constrained electronic enclosures where airflow may be limited but surface area is still required for dissipation. ### B. superGRIP™ Attachment Mechanism Unlike traditional heat sinks that use adhesive tape or require holes drilled into the PCB, the ATS-20D series uses a mechanical clip system: * **Plastic Frame:** A high-strength plastic frame clips onto the base of the BGA component. * **Spring Clip:** A stainless steel spring clip applies consistent pressure across the center of the component, ensuring maximum thermal contact. * **Safety:** This prevents "walking" or shifting during thermal expansion/contraction or vibration. ### C. Thermal Interface Material (TIM) The unit comes with **T766** phase-change material pre-applied. In electronics, the TIM is crucial because it fills microscopic air gaps between the component die and the heat sink base, significantly reducing thermal impedance. --- ## 3. Applications in Electronics This part is commonly found in industrial and telecommunications equipment, including: * **Network Switches/Routers:** Cooling high-speed processing chips. * **Embedded Systems:** For industrial PCs where vertical space is limited. * **Power Electronics:** Dissipating heat from large-scale MOSFET or IGBT modules that utilize BGA-style packaging. --- ## 4. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **20D** | Series/Attachment Type (superGRIP) | | **209** | Specific Fin Geometry and Footprint (70x70mm) | | **C2** | Color/Finish (Blue Anodized) | | **R0** | Revision code |