The **ATS-20D-24-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **blueICE™** series and is designed for high-efficiency cooling in constrained environments. --- ## 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Here is the breakdown: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 7.14°C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 20.00mm | | **Pin Type** | Fine Pitch (High Density) | --- ## 2. Key Electronic Features ### A. pushPIN™ Attachment System This component features a specialized attachment mechanism designed to provide consistent pressure on the electronic component (CPU, FPGA, or GPU). * **Pre-assembled Springs:** Ensures the heat sink is held securely against the chip. * **Plastic/Brass pushPINs:** Provides a secure fit into standard PCB holes (usually 3.0mm holes). ### B. Thermal Interface Material (TIM) The "R0" suffix typically denotes the inclusion of a pre-applied thermal interface. * **ATS-PPS-20:** A high-performance thermal pad or grease is pre-applied to the base to ensure low thermal resistance between the component and the heat sink. ### C. Aerodynamic Fin Design The fin structure is optimized for **forced air cooling** (active airflow). The "D" in the part number represents a specific fin density designed to balance surface area with pressure drop, preventing "dead zones" where heat might get trapped. --- ## 3. Application Use Cases This specific model is commonly found in the following electronic systems: * **Telecommunications:** Cooling network switches and routers. * **Embedded Computing:** Thermal management for industrial Single Board Computers (SBCs). * **Power Supplies:** Dissipating heat from high-power MOSFETs or voltage regulators. * **Medical Electronics:** Used in imaging or diagnostic equipment where reliability is critical. --- ## 4. Mechanical Drawing Reference If you are designing a PCB for this part, note the following layout requirements: ```text Pitch Details: - Hole spacing (Center-to-Center): 38.00 mm - Total Footprint: 45.00 mm x 45.00 mm - Height above PCB: 20.00 mm ```