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  • ATS-20D-25-C2-R0

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    The **ATS-20D-25-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the high-performance family of heat sinks designed for electronic cooling applications. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal properties. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 60.00 mm x 60.00 mm | | **Height (Height off Base)** | 25.00 mm | | **Thermal Resistance (Flowing)** | 6.49°C/W @ 100 LFM | | **Thermal Resistance (Static)** | 1.10°C/W @ 400 LFM | | **Attachment Method** | Push-Pin (Plastic or Brass) | --- ## 2. Component Breakdown The part is engineered to dissipate heat from integrated circuits (ICs) like CPUs, GPUs, or power transistors. ### A. Heat Sink Design (Fin Type) The "D" in the part number often signifies a specific fin pattern (Cross-cut or straight). This design maximizes surface area for convective cooling while allowing air to flow through from multiple directions. ### B. Attachment Mechanism: pushPIN™ Instead of using messy adhesives or thermal tape, this part uses a **spring-loaded push-pin** system. * **Benefits:** Provides consistent pressure on the component, improving thermal interface material (TIM) performance. * **Hardware:** It typically uses a stainless steel or plastic pin with a high-tension spring. ### C. Thermal Interface Material (TIM) The **-C2** suffix indicates that the heat sink comes pre-applied with **ATS-PPS-02** or a similar high-performance thermal grease, which fills microscopic air gaps between the heat sink and the chip. --- ## 3. Application Use Cases This specific heat sink is typically found in: * **Networking Equipment:** High-speed routers and switches. * **Industrial PCs:** Cooling processors in rugged environments. * **Power Supplies:** Managing heat for MOSFETs and voltage regulators. * **LED Systems:** High-power LED arrays that require passive or active airflow cooling. --- ## 4. Part Number Decoder If you are looking for variations, here is how the suffix system works: | Segment | Meaning | | :--- | :--- | | **ATS-20** | Product Series / Footprint | | **D** | Fin style/pattern | | **25** | Height in millimeters (25mm) | | **C2** | Thermal Interface Material (Pre-applied) | | **R0** | RoHS compliance / Revision level |
    ✨ Follow-up Questions
    • ⤷ What are the alternative attachment methods for ATS heat sinks if push-pins are not compatible with my PCB?
    • ⤷ How does the blue anodized finish affect the thermal performance compared to a black finish?
    • ⤷ What is the recommended airflow direction for the ATS-20D series to achieve maximum efficiency?