The **ATS-20D-30-C2-R0** is a specific part number for a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed primarily for cooling electronic components like BGA (Ball Grid Array) packages. --- ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-20D-30-C2-R0 | | **Component Type** | Heat Sink (Passive Cooling) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 30.00mm x 30.00mm x 25.00mm | | **Thermal Resistance** | 3.50 °C/W @ 200 LFM | --- ## Electronic & Mechanical Components ### 1. Thermal Management Profile This component is designed to dissipate heat from integrated circuits (ICs). Its **fluted fin design** (maxiFLOW™) increases the surface area while reducing pressure drop, which allows for more efficient cooling in environments with low to medium airflow. ### 2. pushPIN™ Attachment System The "R0" at the end of the part number typically refers to the specific attachment kit. This system includes: * **Springs:** Provides consistent pressure (Pre-assembled). * **Pins:** Brass or plastic pins that secure the heat sink to the PCB through pre-drilled holes. * **Thermal Interface Material (TIM):** This part usually comes with **T766** pre-applied, which is a phase-change material that fills microscopic gaps between the chip and the heat sink. ### 3. Material Properties * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodizing:** This is not just for aesthetics; it provides surface protection against corrosion and slightly increases emissivity for better heat radiation. --- ## Application Use Cases * **Network Switches/Routers:** Cooling high-speed processors. * **Power Supplies:** Managing heat in MOSFETs or voltage regulators. * **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high.