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  • ATS-20D-31-C2-R0

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    ## Electronic Part Overview: ATS-20D-31-C2-R0 The **ATS-20D-31-C2-R0** is a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" family, designed for thermal management of electronic components such as processors, chipsets, or high-power ICs. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics essential for circuit board thermal design. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Heat Sink Type** | Top Mount (pushPIN™) | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Flow Orientation** | Straight Fin | | **Thermal Resistance** | 25.25° C/W (Natural Airflow) | | **Dimensions (L x W)** | 54.00mm x 54.00mm | | **Height (H)** | 10.00mm | --- ### 2. Physical Design Details * **Fin Configuration:** This model uses a **Straight Fin** design. This is optimized for uni-directional airflow (e.g., from a case fan). * **pushPIN™ Attachment:** The "-R0" suffix indicates the assembly includes a push-pin and spring mechanism. This ensures a consistent pressure (TIM - Thermal Interface Material) against the chip, improving heat transfer efficiency. * **Low Profile:** With a height of only 10mm, it is suitable for 1U servers or slim electronic enclosures where vertical space is limited. --- ### 3. Thermal Performance Data Thermal resistance measures the component's ability to dissipate heat. Lower values are better under high airflow. | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (0.5 m/s)** | 25.25 | | **300 (1.5 m/s)** | 5.92 | | **500 (2.5 m/s)** | 3.32 | | **700 (3.5 m/s)** | 2.21 | --- ### 4. Part Number Breakdown `ATS-20D-31-C2-R0` 1. **ATS:** Advanced Thermal Solutions (Brand). 2. **20:** Series/Style. 3. **D:** Spring type/Pressure (High). 4. **31:** Fin Pattern/Size designator. 5. **C2:** Material/Color (Aluminum, Blue Anodized). 6. **R0:** Revision/Packaging code.
    ✨ Follow-up Questions
    • ⤷ What are the mounting hole dimensions required for this heat sink?
    • ⤷ Is a thermal interface material (TIM) pre-applied to this specific model?
    • ⤷ How does a straight fin design compare to a cross-cut fin design for this part?