The **ATS-20D-32-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for thermal management in electronic assemblies. --- ### 1. Technical Specifications The part number provides details regarding its physical dimensions, material properties, and thermal performance. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin | | **Dimensions (L x W)** | 54.00mm x 54.00mm | | **Height** | 12.70mm | | **Thermal Resistance** | 1.15 °C/W (at 200 LFM) | --- ### 2. Key Components and Features #### A. Thermal Interface Material (TIM) This specific model usually comes pre-applied with **T766**, a high-performance thermal phase-change material. This ensures maximum heat transfer between the semiconductor (CPU/GPU/FPGA) and the aluminum base. #### B. Attachment Mechanism: pushPIN™ Instead of using messy adhesives or clips, this unit uses a push-pin system: * **Compression Springs:** Provides consistent pressure to ensure the heat sink stays in contact with the component. * **Plastic or Brass Pins:** Designed to fit into pre-drilled holes on the Printed Circuit Board (PCB). #### C. Fin Design The "32" in the part number refers to the fin pattern. It utilizes a **Cross-Cut** or **Straight Fin** geometry (depending on specific sub-variants) designed to allow airflow from multiple directions, making it ideal for high-density electronic enclosures. --- ### 3. Part Number Breakdown (Nomenclature) To understand what each segment of **ATS-20D-32-C2-R0** means: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Brand) | | **20** | Push-pin style/series | | **D** | Material/Specific design variation | | **32** | Fin pattern and spacing code | | **C2** | Thermal Interface Material (TIM) type (e.g., T766) | | **R0** | Revision code or packaging code | --- ### 4. Typical Applications * **Embedded Systems:** Cooling for ARM-based processors. * **Networking:** Cooling for ASICs in switches and routers. * **Power Supplies:** Dissipating heat from MOSFETs and voltage regulators.