The **ATS-20D-39-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "Blue Ice" or "Supergrip" thermal management series designed for cooling integrated circuits (ICs) and surface-mount devices. --- ## 1. Technical Specifications Below are the primary physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (2-Pin) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 20.00mm | | **Thermal Resistance** | 1.89°C/W (at 200 LFM) | | **Airflow Path** | Cross-Cut (Omni-directional) | | **Compliance** | RoHS Compliant | --- ## 2. Key Electronic Features ### Thermal Performance The "39-C2" designation refers to the specific fin density and height. With a thermal resistance of **1.89°C/W** at moderate airflow, this heat sink is capable of dissipating significant heat from high-wattage components like FPGAs, processors, or power regulators. ### Mounting Mechanism (Push-Pin) The "R0" at the end of the part number usually signifies the standard mounting kit. This part uses a **Brass Push-Pin** with a compression spring: * **Pressure:** Ensures uniform contact between the heat sink and the chip. * **Stability:** Prevents the heat sink from shifting during mechanical vibration or shipping. ### Thermal Interface Material (TIM) Most ATS parts in this series come pre-applied with **ATS-54**, a high-performance Phase Change Material (PCM). This eliminates the need for external thermal paste and ensures a low thermal impedance between the silicon and the aluminum fins. --- ## 3. Physical Layout The heat sink utilizes a **Cross-Cut** fin design. Unlike straight-fin heat sinks, the cross-cut pattern allows for: 1. **Multi-directional Airflow:** It works effectively regardless of which way the fan is blowing. 2. **Increased Surface Area:** More edges to break up laminar airflow, increasing turbulence and heat transfer efficiency. ### Dimension Breakdown ```text Length: 54.0 mm Width: 54.0 mm Height: 20.0 mm Pitch: Standard High-Density Fin ``` --- ## 4. Typical Applications * **Telecommunications:** Cooling network switches and routers. * **Computing:** Secondary cooling for chipsets or high-speed memory controllers. * **Industrial:** Power supplies and motor drivers where airflow might be irregular.