The **ATS-20D-41-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It is part of their "pushPIN™" series, designed for cooling integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table highlights the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm x 10mm | | **Fin Style** | Straight Fin | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring (Steel) | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Breakdown of the Part Number Understanding the nomenclature helps identify the exact configuration: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **20D:** Series designation (Push-pin attachment system). * **41:** Length/Width dimension class (approx. 40mm). * **C3:** Specific fin height and density configuration. * **R0:** Revision code / Packaging indicator. --- ### 3. Key Electronic Components & Features #### A. Thermal Interface Material (TIM) The base of this heatsink comes pre-applied with **T412**, which is a high-performance thermal pad. This ensures there are no microscopic air gaps between the electronic chip (heat source) and the aluminum base, significantly reducing thermal resistance. #### B. Push-Pin Mounting System Instead of using messy adhesives or permanent solder, this part uses a mechanical **Push-Pin** system. * **Benefits:** It provides consistent pressure (load) on the electronic component, which is critical for maximizing heat transfer without cracking the silicon die. * **Ease of Service:** It allows for non-destructive removal if the PCB needs repair or the component needs to be re-pasted. #### C. Straight Fin Design The fins are oriented in a "Straight Fin" pattern. In electronics cooling, this is optimized for **forced-air cooling** (using a fan). The air flows through the channels between the fins to carry heat away from the PCB. --- ### 4. Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 10.07 | | 300 (1.5 m/s) | 3.20 | | 500 (2.5 m/s) | 2.00 | ---