The **ATS-20D-55-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW™" series, designed to provide high cooling efficiency in environments with constrained airflow. --- ### Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-20D-55-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 25mm x 25mm x 20mm | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 4.84°C/W (at 200 LFM) | | **Compatibility** | R-Series (maxiFLOW™) | --- ### Key Features and Electronic Design #### 1. maxiFLOW™ Geometry The primary feature of this part is the **flared fin structure**. Unlike standard square-fin heat sinks, the maxiFLOW™ design features fins that spread outward. This increases the surface area for heat dissipation and decreases pressure drop, which is critical for electronic components packed tightly on a PCB. #### 2. pushPIN™ Attachment System The "R0" suffix refers to the specific attachment kit. The **pushPIN™** system uses a compression spring and a plastic pin that inserts into holes on the PCB. * **Benefits:** Ensures uniform pressure across the component (like a CPU or FPGA), improving thermal interface material (TIM) performance. * **Reliability:** It is more secure than thermal tape or epoxy, making it suitable for high-vibration environments. #### 3. Material and Finish * **AL6063 Aluminum:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Coating:** Provides corrosion resistance and electrical insulation. It also slightly increases the emissivity of the surface, aiding in radiative cooling. --- ### Performance Overview Thermal resistance is the most critical metric for an electronic heat sink. The lower the number, the better the heat transfer. * **Unducted Flow (100 LFM):** ~7.10°C/W * **High Airflow (700 LFM):** ~2.30°C/W ### Typical Applications This specific size and performance profile are commonly used for: * **FPGAs and ASICs:** High-heat processors in networking equipment. * **Power Modules:** DC-DC converters that generate localized heat. * **Embedded Systems:** Industrial PCs where space is limited but cooling demands are high.