## Analysis of Part Number: ATS-20D-58-C2-R0 The **ATS-20D-58-C2-R0** is a specific electronic component belonging to the **Thermal Management** category. It is a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. --- ### 1. Technical Specifications This part is designed for cooling electronic components (like CPUs, GPUs, or FPGAs) by dissipating heat into the surrounding air. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Dimensions (L x W)** | 40.00mm x 40.00mm | | **Height (Off Base)** | 15.00mm | | **Thermal Resistance** | 10.11°C/W (at 100 LFM) | | **Fin Configuration** | Fine-Pitch (Cross-Cut) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to define the physical and thermal properties of the heat sink: | Segment | Meaning | Description | | :--- | :--- | :--- | | **ATS** | Manufacturer | Advanced Thermal Solutions | | **20D** | Series/Mounting | Indicates the pushPIN™ attachment style | | **58** | Design ID | Refers to the specific fin pattern and size | | **C2** | Thermal Interface | T766 Phase Change Material (Pre-applied) | | **R0** | RoHS Status | RoHS-6 Compliant | --- ### 3. Key Electronic Functions * **Heat Dissipation:** The primary function is to increase the surface area of a semiconductor package, allowing air to carry away heat generated by electrical resistance. * **Push-Pin Mechanism:** The "20D" designation indicates a spring-loaded push-pin assembly. This ensures a consistent pressure (compression force) against the chip, which is vital for maintaining a stable thermal interface. * **Cross-Cut Fin Design:** The fins are designed to allow airflow from multiple directions (omnidirectional), making it suitable for compact electronic enclosures where airflow direction might be inconsistent. * **Thermal Interface Material (TIM):** The **C2** suffix indicates that the part comes with a pre-applied thermal pad, ensuring low thermal resistance between the component and the heat sink right out of the box. --- ### 4. Common Applications * **Network Switches/Routers:** Cooling high-speed processing chips. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. * **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high.