The **ATS-20D-67-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (LxWxH)** | 45mm x 45mm x 20mm | | **Thermal Resistance** | 1.20°C/W (at 200 LFM) | | **Fin Type** | Straight Fin | --- ### 2. Electronic/Physical Characteristics #### A. Thermal Efficiency The "C2" in the part number indicates a specific thermal profile. This heat sink is designed for **forced air cooling** environments. As airflow (measured in Linear Feet per Minute - LFM) increases, the thermal resistance decreases significantly, allowing for higher power dissipation. #### B. The pushPIN™ System This part uses a proprietary attachment mechanism consisting of: * **Compression Spring:** Ensures precise pressure is applied to the electronic component (Integrated Circuit) to maximize thermal contact without cracking the silicon. * **Push-Pins:** These snap into pre-drilled holes in the PCB, eliminating the need for messy adhesives or permanent glues. #### C. Component Protection * **Thermal Interface Material (TIM):** This part usually comes with a pre-applied high-performance T766 phase-change material or grease to ensure no air gaps exist between the chip and the aluminum base. * **Anodization:** The blue anodized finish provides a thin layer of electrical insulation and prevents corrosion. --- ### 3. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **20D** | Series/Pin Type designation | | **67** | Heat Sink height and fin geometry code | | **C2** | Thermal Performance/Material grade | | **R0** | Revision/Packaging code | --- ### 4. Typical Applications * **Network Switches/Routers:** Cooling high-speed processors. * **Power Supplies:** Dissipating heat from MOSFETs. * **Embedded Systems:** Industrial PCs where space is limited but heat generation is high.