ATS-20D-71-C2-R0
AI

The **ATS-20D-71-C2-R0** is a high-performance thermal management component, specifically a **Pin Fin Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like BGA (Ball Grid Array) chips, CPUs, or GPUs.
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## 1. Technical Specifications
The following table outlines the physical and thermal characteristics of the part:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Series** | maxiFLOW™ |
| **Material** | Aluminum (Black Anodized) |
| **Shape** | Square (Pin Fin) |
| **Length/Width** | 45.00 mm x 45.00 mm |
| **Height (Fin Height)** | 20.00 mm |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 6.67°C/W @ 100 LFM (Lower is better) |
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## 2. Key Electronic Features
### A. maxiFLOW™ Design
The "maxiFLOW" geometry features a tapered fin structure. This design increases the surface area for heat exchange while reducing pressure drop, making it highly efficient in environments with forced air cooling (fans).
### B. pushPIN™ Attachment
Unlike adhesive tapes or simple clips, this part uses the **pushPIN™** system:
* **Precision:** Ensures uniform pressure across the component surface for maximum thermal transfer.
* **Reliability:** Prevents the heat sink from shifting during vibration or shipping.
* **Ease of Assembly:** Features a flexible design that allows for easy installation into pre-drilled holes on the PCB.
### C. Thermal Interface Material (TIM)
The part suffix **-R0** typically indicates the inclusion of a high-performance thermal interface material (like a pre-applied phase-change material or thermal pad) to ensure there are no air gaps between the heat sink and the electronic chip.
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## 3. Applications
This specific part is used in high-density electronic packaging where vertical space is limited to 20mm, including:
1. **Telecommunications:** Network switches and routers.
2. **Computing:** Embedded systems and server motherboards.
3. **Power Electronics:** High-power transistors and voltage regulators.
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- ⤷
What is the difference between Pin Fin and Straight Fin heat sinks?
- ⤷ How do I calculate the required LFM (Linear Feet per Minute) for this heat sink?
- ⤷ Are there different spring tensions available for the pushPIN attachment?