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  • ATS-20D-71-C2-R0

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    The **ATS-20D-71-C2-R0** is a high-performance thermal management component, specifically a **Pin Fin Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like BGA (Ball Grid Array) chips, CPUs, or GPUs. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Shape** | Square (Pin Fin) | | **Length/Width** | 45.00 mm x 45.00 mm | | **Height (Fin Height)** | 20.00 mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 6.67°C/W @ 100 LFM (Lower is better) | --- ## 2. Key Electronic Features ### A. maxiFLOW™ Design The "maxiFLOW" geometry features a tapered fin structure. This design increases the surface area for heat exchange while reducing pressure drop, making it highly efficient in environments with forced air cooling (fans). ### B. pushPIN™ Attachment Unlike adhesive tapes or simple clips, this part uses the **pushPIN™** system: * **Precision:** Ensures uniform pressure across the component surface for maximum thermal transfer. * **Reliability:** Prevents the heat sink from shifting during vibration or shipping. * **Ease of Assembly:** Features a flexible design that allows for easy installation into pre-drilled holes on the PCB. ### C. Thermal Interface Material (TIM) The part suffix **-R0** typically indicates the inclusion of a high-performance thermal interface material (like a pre-applied phase-change material or thermal pad) to ensure there are no air gaps between the heat sink and the electronic chip. --- ## 3. Applications This specific part is used in high-density electronic packaging where vertical space is limited to 20mm, including: 1. **Telecommunications:** Network switches and routers. 2. **Computing:** Embedded systems and server motherboards. 3. **Power Electronics:** High-power transistors and voltage regulators. ---
    ✨ Follow-up Questions
    • ⤷ What is the difference between Pin Fin and Straight Fin heat sinks?
    • ⤷ How do I calculate the required LFM (Linear Feet per Minute) for this heat sink?
    • ⤷ Are there different spring tensions available for the pushPIN attachment?