The **ATS-20D-75-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to maximize heat dissipation in high-airflow environments. --- ### 1. Technical Specifications The part number provides specific information about its dimensions, material, and thermal properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W)** | 45.00mm x 45.00mm | | **Height** | 10.00mm | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 5.25°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic Features #### A. maxiFLOW™ Fin Design Unlike standard square-cut fins, the maxiFLOW™ design features a **tapered fin structure**. This reduces pressure drop and increases the surface area exposed to the air stream, significantly improving the thermal transfer efficiency from the semiconductor to the ambient air. #### B. pushPIN™ Attachment System The "R0" suffix indicates the inclusion of the **pushPIN™** assembly system. - It uses a brass pin and a compression spring. - It provides a calculated, consistent pressure on the electronic component, ensuring optimal contact with the Thermal Interface Material (TIM). - This prevents "tilting" or uneven cooling, which can damage sensitive chips like BGA processors. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied. In power electronics, the TIM is crucial because it fills microscopic air gaps between the heat sink and the component, lowering the contact resistance. --- ### 3. Application Use Cases This specific heat sink is typically used for cooling high-heat-density components in tight spaces: * **BGA (Ball Grid Array) Components:** High-speed processors and FPGAs. * **Networking Hardware:** High-performance routers and switches. * **Power Supplies:** Cooling MOSFETs or power ICs. * **Embedded Systems:** Industrial PCs where vertical clearance (10mm height) is limited. --- ### 4. Part Number Breakdown ```text ATS - 20 - D - 75 - C1 - R0 | | | | | | | | | | | +-- Attachment (pushPIN™ / Spring) | | | | +------- Thermal Performance/Color (C1 = Blue Anodized) | | | +------------ Height (10.00mm) | | +---------------- Fin Pitch/Pattern | +--------------------- Serial Identifier +-------------------------- Advanced Thermal Solutions ```