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  • ATS-20D-76-C3-R0

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    The **ATS-20D-76-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the *push-pin* attachment series designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 11.84°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 25mm x 25mm x 15mm | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Physical Design Features * **Fins:** It features a **Straight Fin** design. This is optimized for uni-directional airflow, providing a high surface area to dissipate heat from the component into the surrounding air. * **Material:** Made from lightweight aluminum, which offers high thermal conductivity while remaining cost-effective and durable. * **Anodization:** The blue anodized finish provides surface protection against corrosion and enhances emissivity for radiative heat transfer. --- ### 3. Attachment and Interface The "R0" suffix indicates specific mounting and thermal interface characteristics: * **Push-Pin Assembly:** It uses a brass push-pin with a compression spring. This ensures a consistent pressure (7-10 lbs) across the component, which is critical for minimizing the thermal gap between the heat source and the sink. * **TIM (Thermal Interface Material):** It comes pre-applied with **T412**, a high-performance phase-change material. This eliminates the need for manual application of thermal paste and ensures maximum heat transfer efficiency from the first use. --- ### 4. Thermal Performance (LFM - Linear Feet per Minute) The effectiveness of this heat sink depends heavily on the airflow (forced convection): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100** | 11.84 | | **200** | 4.05 | | **300** | 3.50 | | **400** | 3.15 | ---
    ✨ Follow-up Questions
    • ⤷ How does the thermal resistance of this heat sink change in a natural convection environment?
    • ⤷ What are the specific hole patterns required on the PCB for the push-pin mounting?
    • ⤷ Can the T412 thermal interface material be reused if the heat sink is removed?