ATS-20D-76-C3-R0
AI

The **ATS-20D-76-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the *push-pin* attachment series designed for cooling electronic components like CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 11.84°C/W (at 100 LFM) |
| **Dimensions (L x W x H)** | 25mm x 25mm x 15mm |
| **Attachment Method** | Push-Pin (Brass) |
| **Thermal Interface Material (TIM)** | T412 (Pre-applied) |
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### 2. Physical Design Features
* **Fins:** It features a **Straight Fin** design. This is optimized for uni-directional airflow, providing a high surface area to dissipate heat from the component into the surrounding air.
* **Material:** Made from lightweight aluminum, which offers high thermal conductivity while remaining cost-effective and durable.
* **Anodization:** The blue anodized finish provides surface protection against corrosion and enhances emissivity for radiative heat transfer.
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### 3. Attachment and Interface
The "R0" suffix indicates specific mounting and thermal interface characteristics:
* **Push-Pin Assembly:** It uses a brass push-pin with a compression spring. This ensures a consistent pressure (7-10 lbs) across the component, which is critical for minimizing the thermal gap between the heat source and the sink.
* **TIM (Thermal Interface Material):** It comes pre-applied with **T412**, a high-performance phase-change material. This eliminates the need for manual application of thermal paste and ensures maximum heat transfer efficiency from the first use.
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### 4. Thermal Performance (LFM - Linear Feet per Minute)
The effectiveness of this heat sink depends heavily on the airflow (forced convection):
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| **100** | 11.84 |
| **200** | 4.05 |
| **300** | 3.50 |
| **400** | 3.15 |
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- ⤷
How does the thermal resistance of this heat sink change in a natural convection environment?
- ⤷ What are the specific hole patterns required on the PCB for the push-pin mounting?
- ⤷ Can the T412 thermal interface material be reused if the heat sink is removed?