ATS-20D-90-C2-R0
AI

The **ATS-20D-90-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of this part:
| Parameter | Specification |
| :--- | :--- |
| **Part Number** | ATS-20D-90-C2-R0 |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 25.00mm |
| **Attachment Method** | pushPIN™ (Spring Loaded) |
| **Fin Style** | Straight (High-density) |
| **Thermal Resistance** | 6.36°C/W (at 100 LFM) |
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### 2. Key Features
* **pushPIN™ Attachment:** This system features a flexible mechanism that allows for easy installation and secure pressure, ensuring optimal contact between the heat sink and the electronic component.
* **High Performance:** The fin geometry is optimized for "High-Density" cooling, meaning it provides a larger surface area relative to its footprint.
* **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** thermal phase change material, which fills microscopic air gaps to improve heat transfer.
* **Durability:** The blue anodized finish provides corrosion resistance and increased surface emissivity.
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### 3. Usage and Application
In electronics design, this part is used to prevent **thermal throttling** or component failure.
* **Integrated Circuits (ICs):** Used on BGA (Ball Grid Array) or FPGA packages.
* **Airflow Requirement:** It is designed for "ducted" or "open" airflow environments. The performance improves significantly as the Linear Feet per Minute (LFM) of the fan increases.
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### 4. Thermal Performance Profile
Thermal resistance indicates how effectively the part moves heat away from the silicon.
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 6.36 |
| 300 (1.5 m/s) | 2.21 |
| 500 (2.5 m/s) | 1.67 |
- ⤷
What are the mechanical requirements for the pushPIN mounting holes?
- ⤷ Can this heat sink be used with a custom thermal paste instead of the pre-applied T766?
- ⤷ How do I calculate the junction temperature using the 6.36°C/W resistance value?