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  • ATS-20D-90-C2-R0

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    The **ATS-20D-90-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-20D-90-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 25.00mm | | **Attachment Method** | pushPIN™ (Spring Loaded) | | **Fin Style** | Straight (High-density) | | **Thermal Resistance** | 6.36°C/W (at 100 LFM) | --- ### 2. Key Features * **pushPIN™ Attachment:** This system features a flexible mechanism that allows for easy installation and secure pressure, ensuring optimal contact between the heat sink and the electronic component. * **High Performance:** The fin geometry is optimized for "High-Density" cooling, meaning it provides a larger surface area relative to its footprint. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** thermal phase change material, which fills microscopic air gaps to improve heat transfer. * **Durability:** The blue anodized finish provides corrosion resistance and increased surface emissivity. --- ### 3. Usage and Application In electronics design, this part is used to prevent **thermal throttling** or component failure. * **Integrated Circuits (ICs):** Used on BGA (Ball Grid Array) or FPGA packages. * **Airflow Requirement:** It is designed for "ducted" or "open" airflow environments. The performance improves significantly as the Linear Feet per Minute (LFM) of the fan increases. --- ### 4. Thermal Performance Profile Thermal resistance indicates how effectively the part moves heat away from the silicon. | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 6.36 | | 300 (1.5 m/s) | 2.21 | | 500 (2.5 m/s) | 1.67 |
    ✨ Follow-up Questions
    • ⤷ What are the mechanical requirements for the pushPIN mounting holes?
    • ⤷ Can this heat sink be used with a custom thermal paste instead of the pre-applied T766?
    • ⤷ How do I calculate the junction temperature using the 6.36°C/W resistance value?