The **ATS-20D-93-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the "maxiFLOW" product line, designed to optimize airflow and heat dissipation for electronic integrated circuits (ICs). --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Here is the breakdown of its specifications: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Flowing Air)** | 1.23°C/W @ 200 LFM | | **Thermal Resistance (Static Air)** | 7.37°C/W | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 15.00mm | | **Pitch** | 4.75mm (Variable based on fin design) | --- ### 2. Key Components & Features #### A. The pushPIN™ Attachment Unlike adhesive tapes or simple clips, the "20D" designation indicates a specific attachment system: * **Compression Springs:** Provide precise pressure to ensure maximum contact between the heat sink base and the component. * **Plastic Push Pins:** Allow for secure mounting through pre-drilled holes in the PCB. #### B. maxiFLOW™ Fin Design The geometry of the fins is "flared," meaning they spread outward at the edges. This design: * Increases the surface area for heat exchange. * Reduces pressure drop, allowing air to flow more easily through the sink. * Is ideal for environments where air velocity is high. #### C. Thermal Interface Material (TIM) The **C2** suffix indicates that this model comes pre-applied with **ATS-PPS-11**. This is a high-performance thermal grease that fills microscopic air gaps between the heat sink and the chip to improve heat transfer. --- ### 3. Electronic Application This part is typically used to cool high-heat-generating components such as: * **CPUs / GPUs:** Central or Graphics processing units in embedded systems. * **FPGAs:** Field Programmable Gate Arrays that require stable thermal environments. * **ASICs:** Application Specific Integrated Circuits used in networking or telecommunications. --- ### 4. Part Number Breakdown To understand the "Electronic DNA" of this part: `ATS - 20D - 93 - C2 - R0` 1. **ATS**: Manufacturer (Advanced Thermal Solutions). 2. **20D**: Attachment style (Push-pin with specific spring tension). 3. **93**: Specific internal dimension/fin configuration code. 4. **C2**: Thermal Interface Material type (T766 or equivalent grease). 5. **R0**: Revision or RoHS compliance status.