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  • ATS-20D-96-C2-R0

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    The **ATS-20D-96-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Specification | Details | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | Part of the "pushPIN™" Series | | **Material** | Aluminum | Blue Anodized Finish | | **Fin Type** | Straight / Square | Optimized for directional airflow | | **Thermal Resistance** | 5.63°C/W (Unducted) | Measures cooling efficiency at 100 LFM | | **Attachment Method** | pushPIN™ | Uses a brass pin and steel spring | | **Thermal Interface** | T766 | Pre-applied Thermal Phase Change Material | --- ### 2. Physical Dimensions Precision sizing is critical for ensuring the heat sink fits within the PCB layout without interfering with surrounding components. * **Length:** 40.00 mm * **Width:** 40.00 mm * **Height:** 30.00 mm * **Pitch (Hole spacing):** 45.00 mm (diagonal/center-to-center) --- ### 3. Key Features & Electronics Context The "C2" and "R0" designations in the part number refer to specific material and environmental compliance standards: * **Push-Pin Attachment:** This mechanical system provides high pressure and a secure fit, ensuring the heat sink remains in contact with the semiconductor even under high vibration or shock. * **High Performance Fin Design:** The straight-fin design is intended for systems with a steady flow of forced air (fans). * **C2 Material:** Indicates the use of Aluminum with a Blue Anodized finish, which provides better thermal emissivity and corrosion resistance. * **RoHS Compliant:** The "R0" indicates that the part meets environmental standards for hazardous substances. --- ### 4. Application Example (Code Representation) In thermal simulation or PCB design software (like KiCad or Altium), this part would be represented by its thermal resistance values to calculate the junction temperature ($T_j$): ```python # Simple Thermal Calculation for ATS-20D-96-C2-R0 power_dissipation = 10.0 # Watts (W) ambient_temp = 25.0 # Celsius (°C) thermal_resistance = 5.63 # °C/W (at low airflow) # Formula: Tj = Tamb + (Pd * Rtheta) junction_temp = ambient_temp + (power_dissipation * thermal_resistance) print(f"Predicted Component Temperature: {junction_temp}°C") # Result: 81.3°C ```
    ✨ Follow-up Questions
    • ⤷ What is the difference between ducted and unducted thermal resistance for this part?
    • ⤷ How does the pushPIN™ mounting system compare to adhesive thermal tapes?
    • ⤷ What are the specific airflow requirements (LFM) to reach maximum cooling efficiency?