ATS-20D-96-C2-R0
AI

The **ATS-20D-96-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure.
---
### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics:
| Property | Specification | Details |
| :--- | :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. | Part of the "pushPIN™" Series |
| **Material** | Aluminum | Blue Anodized Finish |
| **Fin Type** | Straight / Square | Optimized for directional airflow |
| **Thermal Resistance** | 5.63°C/W (Unducted) | Measures cooling efficiency at 100 LFM |
| **Attachment Method** | pushPIN™ | Uses a brass pin and steel spring |
| **Thermal Interface** | T766 | Pre-applied Thermal Phase Change Material |
---
### 2. Physical Dimensions
Precision sizing is critical for ensuring the heat sink fits within the PCB layout without interfering with surrounding components.
* **Length:** 40.00 mm
* **Width:** 40.00 mm
* **Height:** 30.00 mm
* **Pitch (Hole spacing):** 45.00 mm (diagonal/center-to-center)
---
### 3. Key Features & Electronics Context
The "C2" and "R0" designations in the part number refer to specific material and environmental compliance standards:
* **Push-Pin Attachment:** This mechanical system provides high pressure and a secure fit, ensuring the heat sink remains in contact with the semiconductor even under high vibration or shock.
* **High Performance Fin Design:** The straight-fin design is intended for systems with a steady flow of forced air (fans).
* **C2 Material:** Indicates the use of Aluminum with a Blue Anodized finish, which provides better thermal emissivity and corrosion resistance.
* **RoHS Compliant:** The "R0" indicates that the part meets environmental standards for hazardous substances.
---
### 4. Application Example (Code Representation)
In thermal simulation or PCB design software (like KiCad or Altium), this part would be represented by its thermal resistance values to calculate the junction temperature ($T_j$):
```python
# Simple Thermal Calculation for ATS-20D-96-C2-R0
power_dissipation = 10.0 # Watts (W)
ambient_temp = 25.0 # Celsius (°C)
thermal_resistance = 5.63 # °C/W (at low airflow)
# Formula: Tj = Tamb + (Pd * Rtheta)
junction_temp = ambient_temp + (power_dissipation * thermal_resistance)
print(f"Predicted Component Temperature: {junction_temp}°C")
# Result: 81.3°C
```
- ⤷
What is the difference between ducted and unducted thermal resistance for this part?
- ⤷ How does the pushPIN™ mounting system compare to adhesive thermal tapes?
- ⤷ What are the specific airflow requirements (LFM) to reach maximum cooling efficiency?