ATS-20E-99-C2-R0
AI

The **ATS-20E-99-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their **blueICE™** series of high-performance heat sinks.
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## 1. Technical Specifications
This part is a high-performance heat sink designed for cooling electronic components, typically integrated circuits (ICs) or processors.
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-20E-99-C2-R0 |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ |
| **Thermal Resistance** | 11.51°C/W @ (0.5 m/s) |
| **Dimensions (L x W x D)** | 45mm x 45mm x 20mm |
| **Fin Style** | Straight Fin |
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## 2. Component Breakdown
The part number itself follows a specific nomenclature that describes its physical properties:
### A. Material & Thermal Properties
* **High Performance:** The C2 designation typically refers to a specific thermal interface material (TIM) or finish quality. In this case, it indicates **Blue Anodized** aluminum, which provides increased surface area efficiency and corrosion resistance.
* **Thermal Management:** The device is designed to dissipate heat from surface-mount components to the ambient air, preventing thermal throttling or component failure.
### B. The pushPIN™ Attachment System
The "R0" suffix and the series type indicate the use of the **pushPIN™** system. This is a critical electronic hardware feature:
* **Mechanism:** It uses a brass or plastic pin with a compressed spring.
* **Security:** It provides precise pressure (load) on the component to ensure optimal thermal contact without damaging the PCB.
* **Installation:** It requires pre-drilled holes in the Printed Circuit Board (PCB).
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## 3. Applications
This part is commonly found in the following electronic environments:
* **Telecommunications:** Cooling for high-speed routers and switches.
* **Embedded Systems:** Industrial PCs and automation controllers.
* **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.
* **Consumer Electronics:** High-end audio/video processing units.
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## 4. Mechanical Drawing Reference
While dimensions are fixed, the airflow direction is critical for this "Straight Fin" design.
```text
[ Airflow ]
|||||||||||||||||| <-- Straight Fins
================== <-- Heat Sink Base
[ Thermal Pad/TIM ]
[ Electronic IC ] <-- Component being cooled
```
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- ⤷
What are the specific PCB hole diameter requirements for the pushPIN attachment?
- ⤷ How does the thermal resistance change as the airflow (LFM) increases for this model?
- ⤷ What is the difference between the C1
- ⤷ C2
- ⤷ and C3 finish options for ATS heat sinks?