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  • ATS-20E-99-C2-R0

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    The **ATS-20E-99-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their **blueICE™** series of high-performance heat sinks. --- ## 1. Technical Specifications This part is a high-performance heat sink designed for cooling electronic components, typically integrated circuits (ICs) or processors. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-20E-99-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 11.51°C/W @ (0.5 m/s) | | **Dimensions (L x W x D)** | 45mm x 45mm x 20mm | | **Fin Style** | Straight Fin | --- ## 2. Component Breakdown The part number itself follows a specific nomenclature that describes its physical properties: ### A. Material & Thermal Properties * **High Performance:** The C2 designation typically refers to a specific thermal interface material (TIM) or finish quality. In this case, it indicates **Blue Anodized** aluminum, which provides increased surface area efficiency and corrosion resistance. * **Thermal Management:** The device is designed to dissipate heat from surface-mount components to the ambient air, preventing thermal throttling or component failure. ### B. The pushPIN™ Attachment System The "R0" suffix and the series type indicate the use of the **pushPIN™** system. This is a critical electronic hardware feature: * **Mechanism:** It uses a brass or plastic pin with a compressed spring. * **Security:** It provides precise pressure (load) on the component to ensure optimal thermal contact without damaging the PCB. * **Installation:** It requires pre-drilled holes in the Printed Circuit Board (PCB). --- ## 3. Applications This part is commonly found in the following electronic environments: * **Telecommunications:** Cooling for high-speed routers and switches. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. * **Consumer Electronics:** High-end audio/video processing units. --- ## 4. Mechanical Drawing Reference While dimensions are fixed, the airflow direction is critical for this "Straight Fin" design. ```text [ Airflow ] |||||||||||||||||| <-- Straight Fins ================== <-- Heat Sink Base [ Thermal Pad/TIM ] [ Electronic IC ] <-- Component being cooled ``` ---
    ✨ Follow-up Questions
    • ⤷ What are the specific PCB hole diameter requirements for the pushPIN attachment?
    • ⤷ How does the thermal resistance change as the airflow (LFM) increases for this model?
    • ⤷ What is the difference between the C1
    • ⤷ C2
    • ⤷ and C3 finish options for ATS heat sinks?