ATS-20F-02-C2-R0
AI

The **ATS-20F-02-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions Inc.*
This part is designed to dissipate heat from electronic components (like CPUs, GPUs, or power transistors) to prevent thermal throttling or hardware failure.
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### 1. Technical Specifications
Below is a breakdown of the physical and thermal characteristics of this specific part number:
| Characteristic | Specification |
| :--- | :--- |
| **Type** | Push-Pin Heat Sink |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W)** | 40mm x 40mm |
| **Height** | 12.7mm |
| **Attachment Method** | Push-Pin (Plastic) with Spring |
| **Thermal Resistance** | 18.32°C/W (at 100 LFM) |
| **Fin Style** | Straight Fin |
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### 2. Key Components & Design Features
#### A. Attachment Mechanism (Push-Pin)
The "F" in the part number indicates a specific attachment style. It uses **plastic push-pins** and **industry-standard springs**.
- **Benefit:** Provides consistent pressure on the high-temperature component, ensuring maximum contact with the thermal interface material (TIM).
- **Hole Pattern:** Requires pre-drilled holes in the PCB.
#### B. Material and Coating
- **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio.
- **Blue Anodization:** Not just for aesthetics; the anodized coating increases surface emissivity, slightly improving radiant heat transfer and providing corrosion resistance.
#### C. Thermal Interface Material (TIM)
The "C2" suffix typically denotes that the heat sink comes pre-applied with a **Thermal Interface Material**. This fills the microscopic air gaps between the heat sink base and the chip to improve heat conduction.
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### 3. Application Use Cases
This specific low-profile (12.7mm) heat sink is commonly used in:
* **Networking Equipment:** Switches and routers where vertical space is limited.
* **Embedded Systems:** Industrial PCs and controllers.
* **Power Supplies:** Cooling voltage regulators or MOSFETs.
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### 4. Part Number Decoder (Quick Reference)
| Prefix | Size | Height | Attachment | Material/Finish |
| :--- | :--- | :--- | :--- | :--- |
| **ATS** | **20** (Series) | **02** (12.7mm) | **F** (Push-Pin) | **C2-R0** (TIM & RoHS) |
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What is the hole-to-hole spacing required on the PCB for this heat sink?
- ⤷ How does the thermal resistance change as airflow (LFM) increases?
- ⤷ Is there a version of this heat sink that uses thermal tape instead of push-pins?