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  • ATS-20F-02-C2-R0

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    The **ATS-20F-02-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions Inc.* This part is designed to dissipate heat from electronic components (like CPUs, GPUs, or power transistors) to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below is a breakdown of the physical and thermal characteristics of this specific part number: | Characteristic | Specification | | :--- | :--- | | **Type** | Push-Pin Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 40mm x 40mm | | **Height** | 12.7mm | | **Attachment Method** | Push-Pin (Plastic) with Spring | | **Thermal Resistance** | 18.32°C/W (at 100 LFM) | | **Fin Style** | Straight Fin | --- ### 2. Key Components & Design Features #### A. Attachment Mechanism (Push-Pin) The "F" in the part number indicates a specific attachment style. It uses **plastic push-pins** and **industry-standard springs**. - **Benefit:** Provides consistent pressure on the high-temperature component, ensuring maximum contact with the thermal interface material (TIM). - **Hole Pattern:** Requires pre-drilled holes in the PCB. #### B. Material and Coating - **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. - **Blue Anodization:** Not just for aesthetics; the anodized coating increases surface emissivity, slightly improving radiant heat transfer and providing corrosion resistance. #### C. Thermal Interface Material (TIM) The "C2" suffix typically denotes that the heat sink comes pre-applied with a **Thermal Interface Material**. This fills the microscopic air gaps between the heat sink base and the chip to improve heat conduction. --- ### 3. Application Use Cases This specific low-profile (12.7mm) heat sink is commonly used in: * **Networking Equipment:** Switches and routers where vertical space is limited. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling voltage regulators or MOSFETs. --- ### 4. Part Number Decoder (Quick Reference) | Prefix | Size | Height | Attachment | Material/Finish | | :--- | :--- | :--- | :--- | :--- | | **ATS** | **20** (Series) | **02** (12.7mm) | **F** (Push-Pin) | **C2-R0** (TIM & RoHS) |
    ✨ Follow-up Questions
    • ⤷ What is the hole-to-hole spacing required on the PCB for this heat sink?
    • ⤷ How does the thermal resistance change as airflow (LFM) increases?
    • ⤷ Is there a version of this heat sink that uses thermal tape instead of push-pins?