The **ATS-20F-04-C2-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed for cooling electronic components such as processors, FPGAs, and ASICs. --- ## 1. Technical Specifications Below are the primary electronic and mechanical specifications for this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 11.55°C/W (Unducted Flow @ 100 LFM) | | **Dimensions** | 45mm x 45mm x 25mm | | **Fin Type** | Fine Pitch (Straight Fin) | | **Thermal Interface** | T766 (Pre-applied Phase Change Material) | --- ## 2. Key Electronic Features ### A. Thermal Performance The "C2" in the part number indicates a specific thermal profile. In electronic systems, this heat sink is designed to dissipate heat away from the semiconductor die to prevent **thermal throttling** or permanent damage. * **Low Airflow:** 11.55°C/W * **High Airflow (800 LFM):** 1.45°C/W * **Efficiency:** The fine-pitch fin design maximizes surface area for forced convection. ### B. The Push-Pin Mechanism Unlike adhesive-based heat sinks, the **R0** variant uses a push-pin system. 1. **Mechanical Stability:** Ensures consistent pressure across the component for better heat transfer. 2. **Material:** The pins are typically brass or plastic with a stainless steel spring. 3. **Drill Pattern:** Requires specific holes in the PCB (Printed Circuit Board). ### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied. This is a high-performance thermal pad that softens at operating temperatures to fill microscopic air gaps between the chip and the heat sink base. --- ## 3. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **20** | Product Series | | **F** | Fin Pattern (Fine-Pitch) | | **04** | Dimensions/Configuration Code | | **C2** | Thermal Performance Level / Material Grade | | **R0** | RoHS Compliant / Revision Status | --- ## 4. Usage Considerations * **Board Layout:** You must ensure the PCB has the correct hole spacing (typically 38mm for this series) to accommodate the push-pins. * **Clearance:** With a height of 25mm, ensure there is no interference with adjacent capacitors or chassis enclosures. * **Airflow Direction:** Straight fin designs are highly directional; they perform best when airflow is parallel to the fins.