The **ATS-20F-06-C3-R0** is a specific high-performance electronic thermal management component. It belongs to the **maxiFLOW™** series produced by **Advanced Thermal Solutions (ATS)**. Below is a detailed breakdown of its specifications, electronic application, and structural design. --- ## 1. Product Overview This part is a **Heat Sink** designed specifically for cooling high-heat-generating electronic components like BGA (Ball Grid Array) packages, CPUs, or GPUs. It uses a patented "spread fin" design to maximize surface area and airflow efficiency. ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Dimensions** | 40mm x 40mm x 19mm | | **Thermal Resistance** | 2.50 °C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Material** | Aluminum (Anodized Blue) | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ## 2. Key Electronic Features ### A. pushPIN™ Attachment System The "R0" at the end of the part number indicates the mounting hardware. It utilizes a **pushPIN™** system that includes: * **Stainless steel springs:** Ensure precise pressure (Force) on the electronic chip to prevent damage while maximizing heat transfer. * **Plastic/Brass pins:** Snap into pre-drilled holes on the PCB (Printed Circuit Order). ### B. Thermal Interface Material (TIM) The device comes with **T766** pre-applied to the base. In electronics, the TIM is crucial because it fills microscopic air gaps between the heat sink and the semiconductor, significantly lowering the thermal resistance of the assembly. ### C. Flow Pattern The **maxiFLOW™** design features a tapered fin structure. This is engineered to: 1. Reduce pressure drop across the heat sink. 2. Increase the velocity of air moving through the fins. 3. Ensure that hot spots on the PCB are cooled evenly. --- ## 3. Structural Dimensions To integrate this into an electronic design (CAD/PCB Layout), the following dimensions are critical: ```markdown - Length: 40.00 mm - Width: 40.00 mm - Height: 19.00 mm - Pin-to-Pin Pitch: 45.00 mm (Diagonal/Square layout dependent) ``` --- ## 4. Application Use-Case This part is typically found in: * **Networking Equipment:** High-speed routers and switches. * **Industrial PCs:** Where airflow might be restricted and high-efficiency fins are required. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators.