The **ATS-20F-10-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling processors and other surface-mount electronic components. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-20F-10-C2-R0 | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | Push Pin (with Springs) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 25mm | | **Thermal Resistance** | 7.89°C/W (at 200 LFM) | | **Fin Style** | XC-Cut (Cross-cut) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic Components & Design #### A. The XC-Cut Fin Design Unlike standard straight fins, the **XC-Cut** pattern creates small square blocks. This increases the surface area for heat dissipation and allows for omnidirectional airflow. This is critical in crowded PCB environments where airflow direction might be inconsistent. #### B. Push Pin Attachment System The part utilizes a mechanical attachment system consisting of: * **Brass Push Pins:** Durable pins that lock into pre-drilled holes on the PCB. * **Compression Springs:** These ensure a consistent, high-pressure contact between the heat sink and the electronic component (CPU/GPU/FPGA), which is vital for efficient heat transfer. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. * **Function:** It fills microscopic air gaps between the heat sink and the chip. * **Benefit:** This reduces contact resistance and eliminates the need for manual thermal paste application during assembly. --- ### 3. Applications This specific part is generally used to cool high-heat emitting components such as: 1. **High-speed Processors (CPUs)** 2. **Field Programmable Gate Arrays (FPGAs)** 3. **Application-Specific Integrated Circuits (ASICs)** 4. **Network Switches and Routers** --- ### 4. Cooling Performance Table The efficiency of this part varies based on the Airflow (LFM - Linear Feet per Minute): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 11.23 | | 200 | 7.89 | | 300 | 6.51 | | 400 | 5.32 |