The **ATS-20F-102-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS)** heat sink designed for cooling integrated circuits (ICs) and other electronic components. --- ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-20F-102-C2-R0 | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Type** | Board Level Heat Sink | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 5.24°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | --- ### Key Electronic & Mechanical Features #### 1. pushPIN™ Attachment System This part utilizes a specialized "pushPIN" mechanism. In electronics assembly, this allows for: * **Uniform Pressure:** Ensures consistent contact between the heat sink and the processor/component. * **Secure Mounting:** Uses a brass or plastic pin with a high-tension spring to prevent the heat sink from shifting during vibration or shipping. #### 2. Fin Design (High Performance) The "F" in the part number often refers to the fin geometry. These are designed for **forced air environments** (fans). The fins are precision-cut to maximize surface area while minimizing pressure drop across the component. #### 3. Material and Thermal Interface * **Aluminum Construction:** Offers a lightweight solution with high thermal conductivity. * **Blue Anodized Finish:** Not only provides aesthetic value but also increases surface emissivity and protects the aluminum from corrosion. * **C2 Designation:** This typically indicates a specific Thermal Interface Material (TIM) or attachment kit configuration provided by ATS. --- ### Component Application This heat sink is commonly used on: * **CPUs/GPUs:** Small form factor processors. * **FPGAs:** Field Programmable Gate Arrays that generate significant heat. * **Telecommunications Gear:** Used in routers and switches where airflow is directed through the chassis.