The **ATS-20F-131-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions Inc. It is part of the "pushPIN™" family, designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Base Dimensions** | 60.00 mm x 60.00 mm | | **Height** | 20.00 mm | | **Fin Style** | Straight Fin | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 3.60 °C/W (at 100 LFM) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: - **ATS-20**: The product family and series identifier. - **F**: Indicates the fin pitch (in this case, "Fine" or a specific density). - **131**: Internal code for specific mechanical dimensions/length. - **C2**: Refers to the thermal interface material (TIM). C2 typically indicates **T766** (a high-performance phase-change material). - **R0**: Revision code or packaging indicator. --- ### 3. Key Electronic Functions While the part does not contain transistors or circuitry, its "electronic" role is critical for the stability of the system: 1. **Thermal Dissipation**: It removes heat from high-power components (like CPUs, FPGAs, or MOSFETs) to prevent thermal throttling or hardware failure. 2. **Spring-Loaded Attachment**: The pushPIN™ mechanism ensures even pressure across the surface of the electronic chip, which is vital for maintaining a consistent thermal bridge. 3. **Low Profile**: At 20mm height, it is designed for electronic enclosures where vertical space is limited but horizontal surface area (60mm x 60mm) is available. --- ### 4. Component Diagram (Conceptual) ```text [ Fin Array ] <-- Heat dissipation area ___________________ | | | AL6063 | <-- Heat Sink Body |___________________| | | | | <-- pushPIN Attachments |_| |_| [ Thermal Pad (C2) ] <-- Interface with Electronic Chip ```