ATS-20F-133-C2-R0
AI

The **ATS-20F-133-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** designed for cooling integrated circuits (ICs) and other electronic packages. It is manufactured by Advanced Thermal Solutions (ATS).
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## 1. Technical Specifications
This part belongs to the **maxiFLOW™** series, which uses a specialized flared fin geometry to maximize surface area for air cooling.
| Parameter | Specification |
| :--- | :--- |
| **Component Type** | Heat Sink |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm |
| **Thermal Resistance (Flowing Air)** | ~3.60°C/W @ 200 LFM |
| **Thermal Resistance (Static Air)** | ~7.40°C/W |
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## 2. Key Electronic Features
### A. pushPIN™ Attachment System
The "R0" suffix indicates the use of the **pushPIN™** assembly. This is critical for electronics because:
* **Uniform Pressure:** It ensures even contact between the heat sink and the chip (e.g., a CPU, FPGA, or GPU).
* **Secure Mounting:** It prevents the component from shifting during vibration or shipping.
* **Tool-less/Easy Install:** Uses pre-drilled holes in the PCB and plastic pins with springs.
### B. Thermal Interface Material (TIM)
The part comes pre-applied with **ATS-CPX-942-T766** phase-change material or high-performance thermal grease. This fills microscopic air gaps between the heat sink base and the electronic component to ensure maximum heat transfer.
### C. Flared Fin Design
The electronic benefit of the flared fin geometry is **reduced pressure drop**. In crowded electronic enclosures, this allows air to flow through the fins more easily, even when the fan speed is low, reducing noise and increasing the lifespan of the electronics.
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## 3. Physical Dimensions (Mechanical)
```text
35.00mm (Width)
___________________
| |
| TOP VIEW | 35.00mm (Length)
|___________________|
| | 15.00mm (Height)
| SIDE VIEW |
|___________________|
```
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## 4. Part Number Breakdown
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions (Manufacturer) |
| **20F** | Series/Version |
| **133** | Unique ID for specific fin count and spacing |
| **C2** | Color/Finish (Blue Anodized) |
| **R0** | Revision/Hardware Kit type |
- ⤷
What are the compatible PCB hole patterns for the pushPIN attachment?
- ⤷ How does the thermal resistance change at different airflow velocities (LFM)?
- ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied TIM?