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  • ATS-20F-133-C2-R0

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    The **ATS-20F-133-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** designed for cooling integrated circuits (ICs) and other electronic packages. It is manufactured by Advanced Thermal Solutions (ATS). --- ## 1. Technical Specifications This part belongs to the **maxiFLOW™** series, which uses a specialized flared fin geometry to maximize surface area for air cooling. | Parameter | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | | **Thermal Resistance (Flowing Air)** | ~3.60°C/W @ 200 LFM | | **Thermal Resistance (Static Air)** | ~7.40°C/W | --- ## 2. Key Electronic Features ### A. pushPIN™ Attachment System The "R0" suffix indicates the use of the **pushPIN™** assembly. This is critical for electronics because: * **Uniform Pressure:** It ensures even contact between the heat sink and the chip (e.g., a CPU, FPGA, or GPU). * **Secure Mounting:** It prevents the component from shifting during vibration or shipping. * **Tool-less/Easy Install:** Uses pre-drilled holes in the PCB and plastic pins with springs. ### B. Thermal Interface Material (TIM) The part comes pre-applied with **ATS-CPX-942-T766** phase-change material or high-performance thermal grease. This fills microscopic air gaps between the heat sink base and the electronic component to ensure maximum heat transfer. ### C. Flared Fin Design The electronic benefit of the flared fin geometry is **reduced pressure drop**. In crowded electronic enclosures, this allows air to flow through the fins more easily, even when the fan speed is low, reducing noise and increasing the lifespan of the electronics. --- ## 3. Physical Dimensions (Mechanical) ```text 35.00mm (Width) ___________________ | | | TOP VIEW | 35.00mm (Length) |___________________| | | 15.00mm (Height) | SIDE VIEW | |___________________| ``` --- ## 4. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **20F** | Series/Version | | **133** | Unique ID for specific fin count and spacing | | **C2** | Color/Finish (Blue Anodized) | | **R0** | Revision/Hardware Kit type |
    ✨ Follow-up Questions
    • ⤷ What are the compatible PCB hole patterns for the pushPIN attachment?
    • ⤷ How does the thermal resistance change at different airflow velocities (LFM)?
    • ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied TIM?