The **ATS-20F-135-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heatsink**. It is designed for cooling electronic components such as CPUs, GPUs, or power modules in space-constrained environments. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by Advanced Thermal Solutions. Here are the primary characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Fin Style** | XC (Cross-Cut) | | **Thermal Resistance** | 3.00°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 35mm x 35mm x 20mm | --- ### 2. Design and Construction The design of this heatsink focuses on maximizing surface area while ensuring secure physical contact with the PCB. * **XC (Cross-Cut) Fin Design:** The fins are cut both vertically and horizontally. This creates a "pin" or "tower" effect which allows for multi-directional airflow, making it highly effective in systems where the direction of the cooling fan may vary. * **Material Selection:** Using aluminum keeps the part lightweight while maintaining high thermal conductivity. The blue anodized finish provides corrosion resistance and improves emissivity. * **pushPIN™ Attachment:** This specific model uses a spring-loaded pin system. This is superior to simple adhesive tapes because it provides a consistent, high-pressure interface between the heatsink and the component, optimizing heat transfer. --- ### 3. Thermal Performance Metrics Thermal resistance indicates how effectively the part moves heat away from the component. A lower number is better. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 6.63 | | 200 (1.0 m/s) | 3.00 | | 400 (2.0 m/s) | 1.81 | | 600 (3.0 m/s) | 1.42 | --- ### 4. Key Component Benefits 1. **Pre-Assembled:** Usually comes with the pushPIN™ and springs pre-installed to reduce assembly time on the production line. 2. **Thermal Interface Material (TIM):** Most "-R0" variants come with a pre-applied high-performance phase-change material or thermal pad, ensuring no additional paste is required during installation. 3. **Mechanical Stability:** The mechanical attachment prevents the heatsink from shifting or falling off during high-vibration scenarios (common in industrial or aerospace applications).