The **ATS-20F-140-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** designed for cooling integrated circuits (ICs) and other electronic packages. --- ### 1. General Specifications This part belongs to the **maxiFLOW™** series by Advanced Thermal Solutions (ATS). It is engineered for high-velocity airflow environments. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-20F-140-C2-R0 | | **Type** | Board Level Heat Sink | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | --- ### 2. Physical Dimensions Precision sizing is critical for ensuring compatibility with the PCB layout and avoiding physical interference with surrounding components. | Dimension | Measurement (Metric) | Measurement (Imperial) | | :--- | :--- | :--- | | **Length (A)** | 25.00 mm | 0.98 in | | **Width (B)** | 25.00 mm | 0.98 in | | **Height (C)** | 25.00 mm | 0.98 in | | **Pitch (E)** | 30.00 mm | 1.18 in | | **Pitch (F)** | 30.00 mm | 1.18 in | --- ### 3. Thermal Performance Thermal resistance indicates how effectively the heat sink transfers heat away from the component into the ambient air. Lower values represent better cooling. * **Thermal Resistance (Unducted Flow):** 7.28 °C/W @ 100 LFM (Linear Feet per Minute) * **Thermal Resistance (Ducted Flow):** 2.91 °C/W @ 100 LFM * **Fin Configuration:** The "maxiFLOW" design features a high-aspect-ratio fin structure that maximizes surface area while minimizing pressure drop. --- ### 4. Mounting System (pushPIN™) The **pushPIN™** assembly is a key feature of this part, consisting of: 1. **Spring:** Provides a consistent "Force On Chip" (FOC) to ensure optimal thermal interface contact. 2. **Push Pin:** Available in brass or plastic, designed to snap into pre-drilled holes on the PCB (typically 3.175mm holes). 3. **TIM (Thermal Interface Material):** Usually comes pre-applied with a high-performance Phase Change Material (PCM) or thermal grease to bridge the microscopic gaps between the chip and the heat sink. --- ### 5. Part Number Breakdown * **ATS:** Advanced Thermal Solutions. * **20:** Series identifier. * **F:** Fin pitch/style. * **140:** Dimensional code. * **C2:** Material/Thermal Interface (Blue Anodized / T766 Thermal Grease). * **R0:** RoHS compliance and revision status.