The part number **ATS-20F-142-C3-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Specification Overview The following table breaks down the technical characteristics of this specific thermal management component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Category** | Thermal Management - Heat Sinks | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Thermal Resistance** | 4.92°C/W @ 100 LFM (Linear Feet per Minute) | | **Shape** | Square, Fine Pitch Fins | --- ### 2. Physical Dimensions Precision sizing is critical for ensuring the heat sink fits within the PCB layout without interfering with surrounding components. * **Length:** 30.00 mm * **Width:** 30.00 mm * **Height:** 15.00 mm * **Hole Pattern:** 24.00 mm (Distance between push pin holes) --- ### 3. Component Breakdown (Nomenclature) The part number can be decoded to understand its specific configuration: 1. **ATS**: Manufacturer prefix (Advanced Thermal Solutions). 2. **20F**: Series designation (typically refers to the fin style and attachment type). 3. **142**: Dimensional code for the specific footprint (30mm x 30mm). 4. **C3**: Material/Finish code (indicates Blue Anodized finish). 5. **R0**: Revision or specific packaging/material compliance code. --- ### 4. Key Features & Applications * **High Efficiency:** Uses a "Fine Pitch" fin design which increases the surface area for heat dissipation compared to standard extrusions. * **Pre-assembled Thermal Interface:** These units usually come with a **Thermal Interface Material (TIM)** pre-applied to the base to ensure optimal heat transfer from the chip. * **Push Pin Mounting:** Provides a secure mechanical attachment to the PCB, ensuring constant pressure on the electronic component for consistent cooling performance. * **Common Use Cases:** * Network Switches and Routers. * Embedded Computing Systems. * Power Supplies and Voltage Regulators.