## Overview of ATS-20F-147-C3-R0 The **ATS-20F-147-C3-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **blueICE™** series and is specifically designed for cooling electronic components like BGA (Ball Grid Array) packages. --- ### Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | Push-Pin (2-Pin) | | **Thermal Resistance** | 13.65°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 10.00mm | | **Fin Style** | Straight Fin | | **Spring Type** | Brass | --- ### Key Electronic & Mechanical Components #### 1. Heat Sink Body The core is made of **aluminum**, chosen for its excellent thermal conductivity and lightweight properties. The **Black Anodized** finish increases the surface emissivity, allowing for better heat radiation compared to bare metal. #### 2. Push-Pin Attachment This model uses a **2-pin push-pin system**. - **Spring-loaded pins:** These provide a precise amount of pressure (preload) against the electronic chip to ensure maximum contact with the thermal interface material (TIM). - **Material:** Usually made of brass or plastic with a stainless steel spring. #### 3. Thermal Interface Material (TIM) The "C3" in the part number often indicates the type of thermal interface pre-applied to the base. - It typically features **T766** phase-change material or a similar high-efficiency pad. - **Function:** Fills microscopic air gaps between the CPU/GPU and the heat sink to lower thermal resistance. --- ### Application Usage This specific part is commonly found in: * **Networking Equipment:** Routers and switches. * **Embedded Systems:** Industrial PCs and controllers. * **Power Electronics:** Voltage regulators and high-speed processors that require compact cooling solutions. ---