The **ATS-20F-156-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Thermal Resistance** | 4.14°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Fin Style** | Straight (Vertical) | --- ### Key Components & Design Features #### 1. Push-Pin Attachment System The "20F" in the part number indicates the use of the **pushPIN™** mounting system. This consists of: * **Plastic/Brass Pins:** Inserted through pre-drilled holes in the PCB. * **Compression Springs:** Provide precise vertical pressure (TIM compression) to ensure maximum heat transfer between the component and the heat sink. #### 2. Thermal Interface Material (TIM) The "C2" suffix typically denotes that the heat sink comes with a **pre-applied thermal interface material**. This is a phase-change material or high-conductivity grease that fills microscopic air gaps between the heat sink base and the electronic chip. #### 3. Fin Geometry * **Cross-Cut / Straight Fin:** The design is optimized for airflow. The 25mm height allows for a significant surface area-to-volume ratio. * **Heat Dissipation:** It is designed for **forced air cooling** (active cooling with a fan), though it can function in passive environments with reduced efficiency. --- ### Typical Applications This specific heat sink is commonly found in: * **Telecommunications:** Networking switches and routers. * **Industrial PC:** Embedded systems and industrial controllers. * **Power Electronics:** Voltage regulators and high-speed motor drivers. --- ### Thermal Performance Overview The thermal resistance of this part varies based on the airflow (LFM - Linear Feet per Minute): * **@ 100 LFM:** 4.14°C/W * **@ 300 LFM:** 2.00°C/W * **@ 500 LFM:** 1.60°C/W *Note: Lower °C/W values indicate better cooling performance.*